Omron Corporation

Yuki Ushiro

Daisuke Inoue

Hiroto Katsura

Yusuke Nakayama

Takaaki Sanda

Naomi Uehara

Motoharu Okuno

Naoki Nishimori

Makoto Sugimoto

Yusuke Hayashi

Hiroyuki Mizusaki

Tsuyoshi Miyata

Kazunari Komai

Hiroyuki Tsuchida

Takashi Muramatsu

Masaki Nakamura

Eiji Teramoto

Takamasa Kameda

Toyohiro Imaizumi

Tsutomu Kume

Makoto Kasuya

Makoto Iwai

Yukitaka Kishimoto

Inoue Naoto

A sensor includes: a receptacle connectable to an external plug; a second housing accommodating at least part of the receptacle; a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least part of the main substrate and shielding an electromagnetic wave emitted from the main substrate and/or an electromagnetic wave to penetrate the main substrate from the outside; a first housing accommodating at least part of the main substrate and at least part of the shield film; a flexible substrate connecting the main substrate and the receptacle; and a protection member abutting on an end of the shield film from the side opposite to the main substrate, the end of the shield film facing the flexible substrate.

Sensor having shield film covering main substrate for immunizing noise

An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.

Electronic apparatus and proximity sensor

Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.

Method of manufacturing sensor

A sensor is provided with a cylindrical-shaped housing which has an opening formed at one end, an electronic component which is housed in the housing, a cylindrical-shaped clamp of which one end is inserted into the housing from the opening, and a sealing resin which seals the gap between the inner wall of the housing and the outer wall of the clamp. On the outer wall, the clamp has a rib which rises towards the inner wall of the housing. The rib includes an apex and a sloped surface which extends from the apex towards another end of the clamp and which intersects the outer wall of the clamp. The sealing resin, which exudes from between the inner wall of the housing and the apex and which is positioned on the sloped surface, has a recess resulting from surface tension.

Sensor and manufacturing method thereof

Provided is a proximity sensor that can limit degradation in voltage resistance. A proximity sensor includes: a housing; a coil portion that is accommodated in one end of the housing; a clamp portion that is connected to the other end of the housing; a substrate which is accommodated inside the housing and the clamp portion, and on which a circuit electrically connected to the coil portion is mounted; a shield that covers a part of the substrate located on a side of the housing; and a resin portion which is arranged inside the housing and the clamp portion, and covers at least a part of the substrate. The shield has an extension portion which extends to an inside of the clamp portion and covers at least a part of the circuit located inside the clamp portion.

Proximity sensor

This proximity sensor includes: a cylindrical housing having an opening at one end in the axial direction; a detection part housed at the other end of the housing and detecting the presence or absence of a detection target contactlessly; a substrate housed in the housing and mounted with a control circuit for controlling the detection part; a detection part shield preventing external noise from entering the detection part and including a first face part adhered to the front surface on the other side of the detection part, and a side face part configured from multiple side pieces connected to the outer periphery of the first face part and bent from the first face part to cover the side surface of the detection part; and a resin provided around the detection part and the detection part shield.

Proximity sensor, and assembly method of proximity sensor

The sensor adaptor includes a case body of which a front end is closed and a rear end is open, a cap body being engageable with the rear end of the case body, a seal member interposed between the case body and the cap body, and a fixing portion configured to fix the case body to the mounting portion. A part of the sensor is inserted into an accommodation space of the case body, and the remaining portion of the sensor is drawn out to the outside via an opening of the cap body. The seal member is disposed on a rear end side of the case body to surround the sensor. The seal member is brought into close contact with the case body and the sensor. Accordingly, a gap between the part of the sensor and the case body is sealed from an external space by the seal member.

Sensor mounting structure and sensor adaptor

Provided is a cable disconnection preventing structure or the like in which a conducting wire is not cut at a connecting portion at which a distal end of a conducting wire is connected to a substrate or the like even when a cable is pulled. The cable disconnection preventing structure () comprises a case () and a conducting wire fixing member () which fixes a conducting wire () exposed from a sheath () to the sheath () at one end portion of the cable (). The conducting wire () is disposed between an inner surface () around the cable hole () and the conducting wire fixing member ().

Cable disconnection preventing structure

A proximity sensor in which generation of voids in a resin sealing portion sealing an inside of a housing can be suppressed and thus a yield is improved. The proximity sensor includes a housing, a detection coil, a circuit board and a resin sealing portion. The circuit board is accommodated in the housing to partition an internal space of the housing, and the resin sealing portion covers at least a part of the circuit board by filling the internal space of the housing and thus seals a covered portion of the circuit board. A resin injection port configured to inject a liquid resin forming the resin sealing portion by curing the liquid resin is provided in the housing, and a cutout portion having a notch shape or an opening shape is provided in the circuit board to include at least a part of a portion facing the resin injection port.

To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and an extension part extending from the base and bonding to the sealing resin part. The bonding intermediating part is fixed to the cable by welding the base onto the sheath.

Electronic apparatus and method of manufacturing same

To provide an electronic apparatus having particularly excellent environmental resistance. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and a cylindrical protrusion protruding toward a tip side of the cable. All of an inner circumferential face and an outer circumferential face of the protrusion and an end face at a tip side of the protrusion in an axial direction are covered by the sealing resin part.

Electronic apparatus and electric cable sealed therein

An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member, a cylindrical clamp holding the cable, and a sealing part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath covering the core wire, and the core wire is exposed at an end of the cable without being covered by the sheath. The bonding intermediating member is bonded to the sheath and the sealing part. The sealing part is formed of an epoxy resin, the bonding intermediating part is formed of a resin having a bending elastic modulus in the range of 80 MPa to 210 MPa, and the cable is formed of a material having a suspending flattening ratio in the range of 0.30 to 0.71.

Electronic apparatus

A first light-blocking member and a second light-blocking member are adhered to each other by forming a light-transmitting layer having a light-transmitting composition serving as a base material and a light-transmitting filler different in index of refraction from this light-transmitting composition on a front surface of the first light-blocking member. A liquid light curing adhesive is applied to a front surface of the light-transmitting layer. The second light-blocking member is arranged on the front surface of the light-transmitting layer to which the liquid light curing adhesive has been applied. The liquid light curing adhesive is cured by irradiating the light-transmitting layer with light having a prescribed wavelength laterally from a side of the light-transmitting layer so as to adhere the light-transmitting layer and the second light-blocking member to each other. By adhering light-blocking members to each other, an adhesion operation may easily and quickly be performed with sufficient adhesion strength.

Adhesion structure of light-transmitting member and light-blocking members, method of manufacturing optical module including light-transmitting member and light-blocking members, and optical module

Growing community of inventors

Ayabe, Japan

Yuki Ushiro