Mitsubishi Electric Corporation

Yuki Terado

Shinji Sakai

Kazuya Hokazono

Mitsutaka Hano

Shiori Uota

Jun Fukudome

A semiconductor device includes a first switch and a first driver. The first switch selects and outputs one of a power supply potential and a generated potential as a first switch output potential based on a synchronization signal from a transmission circuit and a delayed signal delayed from the synchronization signal. The first driver charges a gate of a bipolar transistor element based on the synchronization signal of the transmission circuit and the first switch output potential.

Semiconductor element driving circuit and semiconductor element driving device

A semiconductor package includes: a plurality of die pads; a plurality of semiconductor chips provided on the plurality of die pads respectively; a plurality of lead terminals connected to the plurality of semiconductor chips respectively; and a package sealing the plurality of die pads, the plurality of semiconductor chips, and the plurality of lead terminals, the plurality of die pads and the plurality of lead terminals are exposed from a lower surface of the package, and on the lower surface of the package, grooves are provided among the die pads adjacent to one another and among the lead terminals adjacent to one another.

Growing community of inventors

Tokyo, Japan

Yuki Terado