Rohm Co., Ltd.

Other

Yuki Tanuma

Tomoharu Horio

Hiroaki Watanabe

Yusuke Nakakohara

Takumi Yamade

Satoshi Nakamura

Satoshi Uchida

Minoru Murayama

Okimoto Kondo

Satohiro Kigoshi

Hiroyuki Tajiri

Tadatoshi Miwa

Norio Yoshizawa

Gen Muto

Hideyuki Utsumi

Chikoto Ikeda

Takeyuki Adachi

Kazumi Morimoto

A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.

Semiconductor light emitting device

A semiconductor light-emitting device, includes: a semiconductor light-emitting element; a support including a base and a conductive part and configured to support the semiconductor light-emitting element; and a cover configured to overlap the semiconductor light-emitting element as viewed in a first direction, and to transmit light from the semiconductor light-emitting element, wherein the cover includes a base layer having a front surface and a rear surface which transmit the light from the semiconductor light-emitting element and face opposite sides to each other in the first direction, wherein the rear surface faces the semiconductor light-emitting element, wherein the base layer includes a plurality of undulation parts bonded to the support by a bonding material, and wherein the undulation parts are more uneven than the rear surface.

Semiconductor light-emitting device

An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.

Optical apparatus

A light-emitting module is provided with a light-emitting element, a base, and a wiring pattern. The base includes an installation surface facing in a first direction and a mounting surface facing in a second direction which is at right angles to the first direction. The light-emitting element is installed on the installation surface. The wiring pattern is formed on the base and is in electrical contact with the light-emitting element. The base includes a pair of mounting recesses recessed from the mounting surface and spaced from each other in a third direction which is at right angles to both the first direction and the second direction. The wiring pattern includes a pair of mounting-surface electrodes respectively covering at least a part of the pair of mounting recesses.

Light-emitting module, light-emitting device and method of making light-emitting module

A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Light emitting device

The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

Light emitting device and optical device

An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

LED light source unit for backlight of liquid crystal display, and liquid crystal display

A light emitting device includes a light emitting element, a wire, and a substrate. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface. The light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface. The wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

An LED lighting apparatus of the invention includes a substrate having a length in a first direction and a width in a second direction. LED chips are supported on the substrate along the first direction. A light guide, having a thickness in the second direction, includes an incident surface, a reflective surface and an emitting surface. The incident surface faces in a third direction perpendicular to the first and second directions for receiving light emitted from the LED chips. The reflective surface spreads in the first and third directions and reflects light from the incident surface in the second direction. The emitting surface spreads in the first and third directions and allows light from the reflective surface to exit. The substrate is supported by a case that includes side plates around the light guide and a bottom plate connecting the side plates.

LED lighting apparatus

A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.

Light emitting device, manufacturing method thereof, and optical device

An infrared data communication module (A) includes a substrate () consisting of a first layer (A) and a second layer (B), where the first layer is formed with a recess () open at its obverse surface, and includes the opening of the recess () and the second layer is fixed to the first layer (A) on the side opposite from the opening. The module also includes a bonding conductor layer (A) covering at least the bottom surface of the recess (), a light emitting element () mounted on the bonding conductor layer (A), and a heat dissipating conductor layer (C) sandwiched between the first layer (A) and the second layer (B) and connected to the bonding conductor layer (A).

Optical communication module

A tilt sensor includes a mount board, a cover, a light emitting and two light receiving elements on the mount board. A case, provided between the mount board and the cover, is formed with an inner space surrounded by the light emitting element and the light receiving elements. A rolling member, movable in the inner space, can take a complete shielding position, a partial shielding position and an unshielding position. At the complete shielding position, the rolling member blocks the light from the light emitting element so that no light reaches the two light receiving elements. At the partial shielding position, the rolling member blocks the light so that the light reaches only one of the two light receiving elements. At the unshielding position, the rolling member does not block the light at all so that the light reaches the two light receiving elements.

Growing community of inventors

Kyoto, Japan

Yuki Tanuma