Mitsubishi Materials Corporation

Mistubishi Materials Corporation

Yuki Taninouchi

Naoki Kato

Kenji Kubota

Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu&#x2014;Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu&#x2014;Sn alloy layer is an alloy layer containing CuSnas a major proportion and having a compound in which a part of Cu in the CuSnis substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 &#x3bc;m or more and 0.6 &#x3bc;m or less; an oil-sump depth Rvk of the Cu&#x2014;Sn alloy layer is 0.2 &#x3bc;m or more; an area rate of the Cu&#x2014;Sn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance

Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu&#x2014;Ni&#x2014;Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu&#x2014;Ni&#x2014;Sn alloy layer is made of: fine Cu&#x2014;Ni&#x2014;Sn alloy particles; and coarse Cu&#x2014;Ni&#x2014;Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 &#x3bc;m and not more than 0.6 &#x3bc;m, an area ratio of the Cu&#x2014;Ni&#x2014;Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

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Naka, Japan

Yuki Taninouchi