Shin-etsu Chemical Co., Ltd.

Yuki Tanaka

Akihiro Endo

Takanori Ito

Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si&#x2014;H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.1-1,000 ppm (mass), inclusive, with respect to component (a) in terms of the mass of the platinum group metal element; (e) a reaction regulator, as required; (f) 50-300 parts by mass, inclusive, of a silicone resin; and (g) 0.1-20 parts by mass, inclusive, of an adhesive component selected from (g-1) or (g-2).

Thermally conductive thin-film cured product, method for producing same, and thermally conductive member

Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m&#xb7;K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si&#x2014;H group.

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Annaka, Japan

Yuki Tanaka