Fujikura Limited

Yuki Suto

Michikazu Tomita

Satoshi Okude

Shingo Ogura

Tetsu Hammura

Eiji Takenaka

Naoki Takayama

Go Katsura

Katsumasa Takahashi

Taku Uchida

An output control method for adjusting an output of a radio communication module includes a temperature adjustment step, a transmission step, a feedback control step, a measurement step, and an output control step. The temperature adjustment step sets a temperature of the radio communication module to a predetermined set temperature by a temperature adjusting mechanism. The transmission step has a first antenna transmit a radio signal by sending a transmission signal of a predetermined frequency to the radio communication module. The feedback control step controls an output of the transmission signal based on a comparative result between a power value obtained by detecting the transmission signal and a predetermined threshold value of power. The measurement step receives the radio signal by a second antenna, and measures an equivalent isotropic radiated power of the radio signal. The output control step adjusts an output of the transmission signal based on the equivalent isotropic radiated power measured in the measurement step.

Output control method of radio communication module, manufacturing method of radio communication module and output control unit of radio communication module

An evaluation device includes a radio communication module that contains a temperature regulator that adjusts a temperature of a radio communication module to be evaluated, a housing case that houses the radio communication module and the temperature regulator, a gas supplier that supplies dry gas inside the housing case, and a measurement antenna that is disposed so as to face the radio communication module, and that transmits and receives radio waves for measurement. The housing case includes a case main body and a shutter plate that closes an opening of the case main body. The shutter plate is formed of a dielectric foam material, and the shutter plate is capable of contacting and separating from an open edge of the case main body. At least a part of the shutter plate separates from the open edge of the case main body to release gas from inside the housing case when an inner pressure of the housing case is greater than or equal to a predetermined value.

Evaluation device of radio communication module

A semiconductor pressure sensor of the invention, includes: a base body () including: a lead frame () having a first surface and a second surface; and a support () that supports the lead frame () and is made of a resin; a pressure sensor chip () provided on the first surface of the lead frame (); and a controller () that is provided on the second surface of the lead frame (), is implanted in the support (), is formed in the shape having a plurality of surfaces, includes a stress relief layer () that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (), and receives a sensor signal output from the pressure sensor chip () aid thereby outputs a pressure detection, the pressure sensor chip () at least partially overlapping the controller () in plan view.

Semiconductor pressure sensor

A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.

Wiring body assembly, structure with conductor layer, and touch sensor

Pressure sensor

Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.

Semiconductor package and method for manufacturing the same

A semiconductor package includes a semiconductor substrate having a semiconductor device arranged on one surface thereof; a cap substrate having one surface that opposes the one surface of the semiconductor substrate via a gap; a spacer that is arranged between the one surface of the semiconductor substrate and the one surface of the cap substrate, and that joins the semiconductor substrate and the cap substrate; and a filter that is provided on the cap substrate so as to overlap with the semiconductor device without overlapping with the spacer. The semiconductor package and method of manufacture can suppress exfoliation of the filter caused by chipping during the dicing step.

Growing community of inventors

Sakura, Japan

Yuki Suto