Nitto-denko Corporation

Yuki Sugo

Nao Kamakura

Takeshi Matsumura

Sadahito Misumi

Tomoaki Ichikawa

Yoshio Terada

Makoto Namikawa

Satoshi Honda

Daisuke Uenda

Ryota Mita

Youhei Maeno

Mayu Shimoda

Mitsuaki Fusumada

Yuta Kimura

Tsuyoshi Ishizaka

Yoshinori Yoshida

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 &#x3bc;m or more and 50 &#x3bc;m or less.

Thermal bonding sheet and thermal bonding sheet with dicing tape

A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

Sheet for heat bonding, and sheet for heat bonding having dicing tape

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90&#xb0; C. of the pre-sintering layer is not less than 0.27 MPa&#xb7;s. Thickness of the pre-sintering layer is 30 &#x3bc;m to 200 &#x3bc;m.

Sheet and composite sheet

A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.

Sheet for heat bonding and sheet for heat bonding having dicing tape

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 &#x3bc;m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet () has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet () and a dicing tape (). The dicing tape () has a lamination structure containing a base material () and an adhesive layer (), and the sinter-bonding sheet () is positioned on the adhesive layer () of the dicing tape ().

Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet

A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

Joint manufacturing method

A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device

A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5&#xb0; C./sec from 80&#xb0; C. to 300&#xb0; C. under pressure of 10 MPa, and then held at 300&#xb0; C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5&#xb0; C./sec from 80&#xb0; C. to 300&#xb0; C. under pressure of 10 MPa, and then held at 300&#xb0; C. for 2.5 minutes is in a range of 0.005 &#x3bc;mto 0.5 &#x3bc;m.

Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23&#xb0; C. to 500&#xb0; C. in an air atmosphere at a heating rate of 10&#xb0; C./min, a value obtained by subtracting a weight decrease amount (%) at 300&#xb0; C. from a weight decrease amount (%) at 500&#xb0; C. is in a range of &#x2212;1% to 0%.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23&#xb0; C. to 400&#xb0; C. in the air at a heating rate of 10&#xb0; C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape

The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25&#xb0; C. after the film adhesive is pasted to a mirror silicon wafer at 40&#xb0; C. of 0.5 N/10 mm or more.

Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

Growing community of inventors

Ibaraki, Japan

Yuki Sugo