Toto Ltd.

Yuki Sasaki

Jun Shiraishi

Shuichiro Saigan

Masahiro Watanabe

Tatsuya Mori

Yutaka Momiyama

Reo Kawano

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate includes first and second major surfaces. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided in the ceramic dielectric substrate and is opposite to the gas feed channel. The first porous part includes a first porous region, and a first dense region denser than the first porous region. The first porous region includes first sparse portions, and a first dense portion. The first sparse portions include pores. The first dense portion has a higher than the first sparse portions. The first dense portion is positioned between the first sparse portions. The first sparse portions include a first wall part provided between the pores.

Electrostatic chuck and processing apparatus

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, a ceramic porous part, and an elastic body. The base plate supports the ceramic dielectric substrate. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The third hole part is positioned at the bonding part. The counterbore part is located in the first hole part. The ceramic porous part is located in the counterbore part. The elastic body faces an end part of the bonding part at the third hole part side.

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, and a ceramic porous part. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part, and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The second hole part is positioned at the base plate. The third hole part is positioned at the bonding part. The counterbore part is located in at least one of the first hole part or the second hole part. The ceramic porous part is located in the counterbore part. The ceramic porous part includes an exposed surface exposed in the third hole part.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second porous parts. The ceramic dielectric substrate includes first and second major surfaces. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided in the ceramic dielectric substrate and is opposite to the gas feed channel. The second porous part is provided in the base plate and is opposite to the gas feed channel. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. The first porous part includes a first porous region including pores and a first dense region. The second porous part includes a second porous region including pores and a second dense region.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate includes first and second major surfaces, and at least one groove. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the groove and the gas feed channel. The ceramic dielectric substrate includes holes communicating with the groove and the gas feed channel and piercing the ceramic dielectric substrate in a first direction from the base plate toward the ceramic dielectric substrate. The first porous part includes at least one porous region including pores, and at least one dense region denser than the porous region. The porous region further includes at least one dense part.

Growing community of inventors

Kitakyushu, Japan

Yuki Sasaki