Nitto-Denko Corporation

Kansai Paint Company, Ltd.

Yuki Saitou

Takeshi Igarashi

Toshitaka Suzuki

Yoshikuni Hirano

Shinji Inokuchi

Hiroko Ikenaga

Koji Yamaguchi

Mitsuru Honjo

Masahiro Kondo

Yoshifumi Yamamoto

Ikko Hanaki

Yoshifumi Morita

A paint film-protecting sheet, which is unwound from a roll for use, and in which occurrence of adhesive transfer at edges thereof is effectively prevented, and a method of manufacturing same are provided. The paint film-protecting sheet is in the form of a roll obtained by winding in a lengthwise direction a pressure-sensitive adhesive sheet formed of a substrate in continuous sheet form and a pressure-sensitive adhesive layer disposed on the substrate. The substrate comprises a resin component made primarily of polyethylene resin or polypropylene resin. The paint film-protecting sheet, after being unwound from the roll, has a percent shrinkage, in the lengthwise direction, of not greater than 1.2% when heated at 80&#xb0; C. for 1 hour.

Paint film-protecting sheet and method of manufacture

A paint film-protecting sheet () is provided which effectively prevents adhesive transfer to the paint film. The paint film-protecting sheet () has a pressure-sensitive adhesive layer which is comprised of a non-crosslinking pressure-sensitive adhesive () adjacent a polyolefin-based resin film serving as a supporting substrate (). At least a surface portion () of the supporting substrate that adjoins the pressure-sensitive adhesive layer satisfies the following conditions: (1) it has an indentation modulus at 25&#xb0; C. (Er) of from 200 MPa to 1,100 MPa and (2) it has an indentation modulus at &#x2212;5&#xb0; C. (Er) of from 400 MPa to 2,400 MPa.

Paint film-protecting sheet

A paint film-protecting sheet () that effectively prevents adhesive transfer to the paint film is provided. The paint film-protecting sheet () includes a pressure-sensitive adhesive (PSA) layer (), which is comprised of a non-crosslinking PSA, disposed on a polyolefin-based resin film serving as a supporting substrate (). At least a surface portion () of the supporting substrate which adjoins the PSA layer is formed of a resin material that satisfies both of the following conditions: (1) it contains W wt % of a LLDPE having a density d of 0.925 g/cmor less, wherein W is greater than or equal to 20; and (2) it has a LLDPE content index &#x3b1; of 400 or more, the LLDPE content index &#x3b1; being defined as (0.935&#x2212;d)&#xd7;W&#xd7;1000.

A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of second ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines. A plurality of third ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines at a predetermined angle with respect to the second ground lines. The third ground lines each connect one end of one adjacent second ground line with the other end of another adjacent second ground line. The ground lines form triangular openings.

Printed circuit board

Growing community of inventors

Ibaraki, Japan

Yuki Saitou