Hitachi Automotive Systems, Ltd.

Hitachi, Ltd.

Yuki Okamoto

Takeshi Morino

Tsutomu Kono

Keiji Hanzawa

Chihiro Kobayashi

Noboru Tokuyasu

Shinobu Tashiro

Naoki Saito

Masayuki Hio

Takahiro Miki

Ryo Sato

Hiroshi Hirayama

Shinya Igarashi

Akio Yasukawa

Yasuo Onose

Hiromu Kikawa

Taiji Shoyama

Masatomo Ide

A thermal type air flow meter, capable of suppressing deformation of a base member at the time of molding to secure dimensional accuracy and reduce an influence of a dimension change on measuring accuracy, is to be placed in an intake passage of an internal combustion engine. The thermal type of air flow meter includes a resin component having a secondary passage into which part of the air passing through the intake passage can flow, and a circuit board configured to output a signal according to an air flow rate based on a signal from a flow rate detecting element disposed on the circuit board. The circuit board on which the flow rate detecting element is disposed is installed so that the flow rate detecting element is placed in the secondary passage. The resin component includes a board fixing part to which the circuit board is fixed, a secondary passage constituting part that is a part of the secondary passage, and ribs provided on a rear surface, which is a side opposite to a surface of the board fixing part, with the ribs forming a grid pattern.

Thermal type air flow meter having a reinforcing structure provided on the base member between the board fixing part and the secondary passage constituting part

A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FSof the present invention, a part of a semiconductor chip CHPis configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHPis exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHPin a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP) and the resin (MR).

Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same

Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FSof the present invention, apart of a semiconductor chip CHPis configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHPis exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHPin a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP) and the resin (MR).

A plate-shaped board is arranged so that fluid passages are respectively formed at a sensor-element mounting surface side of the plate-shaped board and at a backside surface side thereof being opposed to the sensor-element mounting surface side, a curved passage portion is provided which is located upstream of the plate-shaped board and changes its direction so as to form a curved line, and the curved passage portion has an outer-side wall surface including a sloping portion that slopes so that, of two edge portions of the outer-side wall surface in a direction perpendicular to board surfaces of the plate-shaped board, the edge portion located on a sidewall surface, facing the sensor-element mounting surface, of the curved passage portion is positioned closer to an inner wall surface of the curved passage portion than the edge portion located on a sidewall surface opposed to the first sidewall surface, along the sidewall surfaces.

Flow-rate measurement apparatus

Airflow sensor

An object of the present invention is to provide a structure which prevents a particulate contaminant and a liquid contaminant on which centrifugal separation hardly works, from arriving at a sensor element part. In order to attain the above described object, in a heat resistor type air flow rate measuring device which includes an auxiliary passage taking in a part of a fluid flowing in a main passage, and a plate-shaped sensor element installed in the aforesaid auxiliary passage and for detecting a flow rate of the fluid, and is a heat resistor type flow rate measuring device having an auxiliary passage formed along a curved line at 90&#xb0; or more in an auxiliary passage portion at an upstream side from the plate-shaped sensor element, the aforesaid auxiliary passage is formed along a curved line at 90&#xb0; or more on a phantom plane orthogonal to a sensor formation surface of the plate-shaped sensor element and parallel with a flow, and a sensor formation surface side and a rear side of the plate-shaped sensor element have gaps from an auxiliary passage wall surface.

Heating resistor type air flow rate measuring device utilizing an auxiliary passage

An air flow measuring instrument, comprising: an auxiliary passagearranged inside a main passage through which fluid flows, a tabular memberon which a pattern of a heating resistor for measuring an air flow is provided on one face, the tabular member being disposed inside the auxiliary passage so that the one faceon which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage, a heating resistor pattern-side fluid passageportion formed so that the fluid flows between the faceand a passage-forming surfaceof the auxiliary passage, and a back-surfaceside fluid passage portion formed so that fluid flows between a faceon a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portionguiding dust that collides against the end portion to back-surface side fluid passage portionside is provided on upstream-side end of tabular member.

Air flow measuring instrument having dust particle diverting structure

A first sub passage portion and a second sub passage portion are configured so as to form layers on both sides of a separation wall, respectively. A linear passage portion of a third sub passage portion is formed so that a cross section thereof extends within a range across both sides of the separation wall in a direction perpendicular to a wall surface of the separation wall. The cross section is taken along a direction perpendicular to a flow direction of a fluid flowing through the linear passage portion. The separation wall separates the layer of the first sub passage portion and the layer of the second sub passage portion from each other. A first communication passage portion which allows the first sub passage portion to communicate with the third sub passage portion curves to make a directional change and connects a passage wall surface of the first sub passage portion to a side wall of the third sub passage portion by an inclined surface. The passage wall surface is defined by the separation wall. The side wall is located on a side of the second sub passage portion with respect to the separation wall. A through passage which passes through the separation wall is provided in a second communication passage portion which allows the second sub passage portion to communicate with the third sub passage portion.

Thermal type flow measuring device

In a thermal type flow rate measurement apparatus comprising a sub-passage having a detour passage and a hole just before a flow rate measuring part, for preventing its output value from falling onto a negative side when the flow rate is abruptly changed, a slit is formed downstream of a flow rate detecting element located after the detour passage. The slit hole may be arranged between the flow rate detecting element and the outlet port part, and may be opened between a wall surface side and a recess part. Thereby, it is possible to prevent the output value from falling in the negative side upon rise-up thereof.

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Hitachinaka, Japan

Yuki Okamoto