Mec Company Ltd.

Yuki Ogino

Kiyoto Tai

Masayo Kurii

Mami Nakamura

Kaoru Urushibata

Koki Morikawa

Minoru Otani

Jun Nishimine

Masahiro Hayashizaki

Takahiro Sakamoto

Mami Tojima

Provided is a chemical compound represented by the general formula (A), in which each of substituents Qto Qis bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Qto Qis X, and at least one of Qto Qis Y. Ris a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. Ris a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of Rand Ris a divalent organic group, and a is an integer of 1 to 3.

Chemical compound, surface treating agent, surface treating method, and production method for metal-resin composite

A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 &#x3bc;m or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

Microetching agent for copper, copper surface roughening method and wiring board production method

Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Microetching solution for copper, replenishment solution therefor and method for production of wiring board

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Hyogo, Japan

Yuki Ogino