Toppan Printing Co., Ltd.

Toppan Inc.

Yuki Nitta

Koji Imayoshi

Takashi Fujita

Takeshi Tamura

Masashi Sawadaishi

There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.

Method of producing circuit boards

The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

Method of dicing wiring substrate, and packaging substrate

The packaging substrate according to the present invention is a packaging substrate including: a core substrate; an insulating layer formed on one surface or each of both surfaces of the core substrate; and one or more wiring layers formed on the insulating layer and/or embedded in the insulating layer. The packaging substrate has a thin layer portion where the insulating layer is partially thinned at an outer peripheral portion of the insulating layer.

Growing community of inventors

Tokyo, Japan

Yuki Nitta