Kyocera Corporation

Yuki Mori

Shingo Matsuura

Kousuke Katabe

Daisuke Sakumoto

Akira Miyake

Fumiaki Sekine

Mitsuo Yanagisawa

Tomoya Tabuchi

Masayuki Mori

To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base () that has an opening part () constituted by a light-reflecting surface () and a bottom surface (), a light-emitting chip () that is mounted on the bottom surface () of the opening part (), a transparent member () that covers the light-emitting chip (), and an optical member () that is disposed on the transparent member (). The transparent member () is disposed on the bottom surface () of the opening part () in a state where the transparent member () is spaced away from the light-reflecting surface () of the opening part ().

Light-emitting device

A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

Light emitting device and illumination device

The present invention relates to a reflective member. The reflective member includes a reflective layer formed to be porous using an inorganic material. The reflective layer has a porosity of 15-43%. The reflective layer is formed by partly combining a plurality of inorganic particles with each other.

Reflective member, light-emitting device using same and illuminating device

A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

Package for light-emitting device, light-emitting apparatus, and illuminating apparatus

A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body () which mounts thereon a light-emitting device (); a first electrically conductive path (L) formed within the base body (), one end thereof being electrically connected to a first electrode () of the light-emitting device () and the other end thereof being led out to a surface of the base body (); and a second electrically conductive path (L) formed in the base body (), one end thereof being electrically connected to a second electrode () of the light-emitting device (), and the other end thereof being formed on the surface of the base body (). The first electrically conductive path (L) is made smaller in thermal resistance than the second electrically conductive path (L).

Growing community of inventors

Higashiomi, Japan

Yuki Mori