Nichia Corporation

Yuki Miyaura

Tetsuya Yagi

Takeo Kurimoto

A light-emitting device includes a package, at least one light-emitting element and a light-absorbing member. The package defines a recess having an opening at a light extraction surface of the package. A part of the recess is defined by an upward-facing surface of the package. The light-emitting element is mounted on the upward-facing surface of the package. The light-absorbing member is disposed in the recess, spaced apart from the light-emitting element, and having an exposed surface facing upward toward the light extraction surface, the exposed surface being exposed from the upward-facing surface of the package with the exposed surface and the upward-facing surface of the package being on the same plane.

Light-emitting device

A light emitting device includes a package that has an opening, a first outer side surface of a first resin and a second outer side surface of a second resin, the second resin having a reflectance higher than that of the first resin, and the second outer side surface being positioned below the first outer side surface; and a lead frame that is buried in the package such that a part of the lead frame is exposed at a bottom surface of the opening, and a part of the lead frame projects from the second outer side surface.

Light emitting device

With a light emitting device of a package formed by two types of molded resins, entry of water from between the molded resins may cause the light emitting device to be incapable of turning on. A light emitting device of the present invention includes: a package that has an opening at an upper surface thereof; a first molded resin that forms a part of the upper surface of the package; a second molded resin that forms an inner wall surface of the opening of the package; a lead frame that is buried in the package so as to be partially exposed at a bottom surface of the opening of the package, the lead frame having an end portion externally projected outside from a side surface of the package; and a light emitting element that is connected to an upper surface of the lead frame being exposed at the bottom surface of the opening. The second molded resin is higher than the first molded resin in light reflectance to light emitted from the light emitting element. The upper surface of the lead frame buried in the package is disposed so as to be spaced apart from the interface between the first molded resin and the second molded resin.

Growing community of inventors

Komatsushima, Japan

Yuki Miyaura