Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yuki Minamide

Tadashi Endo

Eiichi Hachiya

Kimiaki Sano

Atsushi Tanabe

Yasuichi Okada

Shirou Yamashita

Makoto Nakashima

Jose Camara

Hirotake Nakayama

Eugene W Coleman, Jr

A component imaging unit of an electronic component mounting apparatus has three area cameras, and each of visual fields are common to each other regardless of the area cameras. When the imaging form of the component imaging unit is set to a first mode, a component recognition unit recognizes the electronic components held by the holding unit, based on an image imaged by one area camera. Meanwhile, when the imaging form is set to a second mode, in the component imaging unit, the component recognition unit recognizes the electronic component held by the holding unit, based on each of images, each of which is imaged by three area cameras.

Electronic component mounting apparatus and electronic component mounting method

A lower supporting pin moduleis given a shape having a contact surface. On the occasion of position recognition for determining a position of a pin on the lower supporting pin module, an image of the lower supporting pin moduleis captured, and the image is subjected to recognition processing, to thus detect an outer shape of an upper shaftB. Even when an extraneous matter on a downside surface of a substrate adheres to the contact surface, the position of the lower supporting pin modulecan be stably recognized with superior recognition precision.

Lower supporting pin layout determination apparatus and lower supporting pin layout determination method

A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a component by irradiating light to the component obliquely from below, and a second illuminating device, when the component adsorbed by the adsorbing nozzle and located in the imaging field of vision is a through hole component, only illuminate the downwards extending parts of the component by irradiating light at an irradiation angle closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating device to the component are included. That the component is illuminated by the first illuminating devices and that the component is illuminated by the second illuminating devices are switched based on whether the component is a surface mounted component or a through hole component.

Component mounting device, a component mounting method, an imaging device and an imaging method

An automatic component teaching device, which generates component teaching data accurately indicating a configuration of a component is provided, regardless of size of the component. The automatic component teaching device includes a cover sheet, of which surface is evenly colored in blue and which is formed to be glossy, a lighting fixture, which illuminates a peripheral area including the component with its back facing against a surface of the cover sheet, an image pickup device, which generates a colored image of the component by taking an image in color of the component illuminated by the lighting fixturewith one surface of the cover sheetin blue as its background, and in image processing unit, which identifies a configuration of the component and generates component teaching data from the colored image generated by the image pickup device

Automatic component teaching device

Growing community of inventors

Yamanashi, Japan

Yuki Minamide