Sumitomo Electric Industries, Limited

Other

Nippondenso Co., Ltd.

Yuki Matsuura

Isao Ueoka

Koichi Iwata

Hideyuki Hashimoto

Masaaki Yamauchi

Makoto Takahashi

Yoshitaka Natsume

Masaharu Kurata

Yoshihiro Nakazawa

Shinichi Matsubara

Hiromitsu Kawabe

Hiromitu Asai

An insulated wire having excellent fabricability causing no cracking in the film even after severe winding or rolling fabrication and also having heat resistance comparable to that of polyamideimide is disclosed, in which a first insulation layer of a thermosetting resin composition having a Tg of 250&deg; C. or higher is formed on a conductor, on which a second insulation layer formed of a mixture of a thermosetting resin composition having a Tg of 250&deg; C. or higher and a thermoplastic resin composition having a Tg of 140&deg; C. or higher is formed, and in which the adhesion of the insulation film to the conductor is 30 g/mm or more, and the elongation at break of the insulation film is 40% or more, with the mixing ratio of the thermoplastic resin in the second insulation layer being from 30 to 70% by weight and the ratio T,/T,of the thickness T,of the first insulation layer to the thickness T,of the second insulation layer being within a range of 5/95 to 40/60, and a residual amount of the solvent in an insulation film is 0.05% by weight or less of the total amount of the insulation film in a preferred embodiment.

Insulated wire

An insulated wire comprising a conductor and an insulating coating which has a tensile strength of at least 13 kg/mm.sup.2 and a Young's modulus of at least 270 kg/mm.sup.2, which has good flexibility and resistance to flaw.

An insulated wire comprising a conductor and an insulating coating made from a polyamideimide base coating, which polyamideimide is made of an acid component and a diisocyanate component containing 10 to 80 % by mole of an aromatic diisocyanate compound of the formula: ##STR1## or which polyamideimide is made of an diisocyanate component and an imidodicarboxylic acid that is a reaction product of an acid component and a diamine component, in which the diamine component contains an aromatic diamine compound of the formula: ##STR2## and/or the diisocyanate component contains the above aromatic diisocyanate compound in such an amount that a total amount of the aromatic diamine compound and the diisocyanate compound is from 10 to 80 % by mole based on the total amount of the whole diamine component and the whole diisocyanate component.

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Osaka, Japan

Yuki Matsuura