Toray Industries, Inc.

Yuki Masuda

Ryoji Okuda

Yu Shoji

Kimio Isobe

Masao Tomikawa

Hiroyuki Onishi

Keika Hashimoto

Yutaro Koyama

Ping Li

Tomoyuki Yuba

Yohei Kiuchi

Yukari Arimoto

Jiake Jin

Yuki Takeyama

Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device

The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200&#xb0; C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like. (In the general formula (1), Rand Reach are a divalent aliphatic group, Rand Reach are a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group bonded to an aromatic group by &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), Rand Reach are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), p and q each are an integer number in the range of 0 to 3).

Di-amine compound, and heat-resistant resin and resin composition using the same

The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250&#xb0; C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

Resin composition

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): 

Resin, photosensitive resin composition, electronic component and display device using the same

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein Xrepresents a divalent organic group having 2 to 100 carbon atoms, Yand Yeach represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, Xrepresents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and nand neach represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as Xof the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of Xand X, and (II) an organic group having a diphenyl ether structure is contained as Yof the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Yand Y.

Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device

A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

Resin and photosensitive resin composition

The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Cured film and method for producing same

A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R-Rmay be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), Rrepresents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of Rs in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.

Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device

A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

Photosensitive resin composition

Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

Cured film formed by curing photosensitive resin composition and method for manufacturing same

Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device

Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein Rhas an organic group represented by general formula (3) and an organic group represented by general formula (4).

The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250&#xb0; C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which Xin the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Yrepresents an aromatic diamine residue including 1 to 4 aromatic rings, and in which Xin the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Yrepresents a diamine residue including at least two or more alkylene glycol units in the main chain.

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Otsu, Japan

Yuki Masuda