Panasonic Intellectual Property Management Co., Ltd.

Yuki Maegawa

Hiroshi Nakatsuka

Hideki Ueda

Rie Okamoto

Takeshi Mori

Takeshi Uemura

Keisuke Kuroda

Hitoshi Yoshida

Hideaki Fujiura

Kazuo Goda

Masako Yamaguchi

Takanori Aoyagi

Tsuyoshi Sakaue

Takuya Kajiwara

Takahiro Shinohara

Shoya Kida

A sensor device includes an angular velocity sensor element, an acceleration sensor element, an intermediate member, and an elastic body. Both the angular velocity sensor element and the acceleration sensor element are mounted on the intermediate member. The elastic body is connected to the intermediate member and a fixing part located apart from the intermediate member. The intermediate member is configured to vibrate by receiving a vibration applied to the fixing part.

Sensor device including angular velocity sensor element and acceleration sensor element

A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

Connection assembly

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

Sensor

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Osaka, Japan

Yuki Maegawa