Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yuki Kotani

Masahiro Nakamura

Shozo Oshio

Hiroyoshi Yoden

Tetsushi Konda

Hajime Kishi

Takashi Saruwatari

A connection structure includes: a first structure body and a second structure body which is detachably connected to the first structure body. The first structure body includes a first fitting portion, and the second structure body includes a second fitting portion which is detachably fitted with the first fitting portion. At least one of the first fitting portion or the second fitting portion is an anisotropic elastic structure body including a periodic structure and having an elasticity which differs depending on a direction. When a fitting direction in which the first fitting portion and the second fitting portion are fitted together is a first direction, and a direction which is orthogonal to the first direction is a second direction, the anisotropic elastic structure body has an elasticity which is greater in the second direction than in the first direction.

Connection structure, decoration method, and connection structure body set

A structural body includes: a three-dimensional net shaped body including a plurality of net lines that form a three-dimensional net shape; and a plurality of objects respectively present in two or more of a plurality of spaces partitioned by the plurality of net lines. The plurality of objects are each a mobile object that moves within one of the plurality of spaces or moves over two or more of the plurality of spaces.

Structural body, system, and structural product

An insulating thermally conductive resin composition () includes a matrix resin () and insulators (). The insulators () are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase () which has a hither thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase () is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.

Insulating thermally conductive resin composition

An insulating thermally conductive resin composition () includes a phase-separated structure including: a first resin phase () in which a first resin continues three-dimensionally; and a second resin phase () different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler () unevenly distributed in the first resin phase; and large-diameter inorganic filler () that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 &#x3bc;m. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 &#x3bc;m.

Growing community of inventors

Osaka, Japan

Yuki Kotani