Taiyo Yuden Co., Ltd.

Yuki Kawai

Koji Kano

Naoto Hagiwara

Katsuei Ishida

Kyotaro Goto

An electrochemical device has a positive electrode, a negative electrode, separators, and an electrolyte. The negative electrode has a first and second negative-electrode active-material layers and a negative-electrode collector which has (i) a first principal face on which the first negative-electrode active-material layer is formed, and (ii) a second principal face having a coated area where the second negative-electrode active-material layer is formed, and an uncoated area where no second negative-electrode active-material layer is formed. The negative-electrode collector has multiple through holes that interconnect the first and second principal faces wherein the boundary of the coated area and the uncoated area intersects the opening of at least one of the multiple through holes. The electrochemical device is such that a metallic lithium is electrically connected to the uncoated area and immersed in the electrolyte, to allow for pre-doping of the negative-electrode active-material layers with lithium ions.

Electrochemical device

An electrochemical device has a positive electrode, a negative electrode, separators, and an electrolyte. The negative electrode has: a negative-electrode collector having a first principal face and a second principal face on the opposite side of the first principal face; a first negative-electrode active-material layer formed on the first principal face; and a second negative-electrode active-material layer which is formed intermittently on the second principal face and whose density of negative-electrode active material is lower than that of the first negative-electrode active-material layer. In the electrolyte, the positive electrode, negative electrode, and separators are immersed. The electrochemical device is such that the first and second negative-electrode active-material layers are pre-doped with lithium ions as a metallic lithium is electrically connected to the second principal face where the second negative-electrode active-material layer is not formed, and then immersed in the electrolyte.

An electrochemical device electrode pertaining to one mode of the present invention has a current collector, an aluminum oxide layer, a conductive layer, and an active material layer. The current collector is an aluminum foil. The aluminum oxide layer is formed on a principle surface of the current collector and contains aluminum hydroxide and aluminum oxide. The conductive layer is formed on the aluminum oxide layer and contains conductive material, while the active material layer is formed on the conductive layer.

Electrochemical device electrode and method for manufacturing electrochemical device electrode

An electrochemical device electrode has a current collector, alkalescent resin layers, conductive layers, and active material layers. The current collector is an acid-etched metal foil whose surface has concavities. The alkalescent resin layers are formed and desiccated inside the concavities and exhibit weak alkalinity. The conductive layers are formed on the current collector and the alkalescent resin layers, contain conductive material, and are electrically connected to the current collector. The active material layers are formed on the conductive layers.

Electrochemical device electrode, electrochemical device, and method for manufacturing electrochemical device electrode

[Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card. [Solution] In the electrochemical device RB, the main body of the package PA includes first cover plate, first terminal plate, frame plate, second terminal plate, and second cover platestacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates, by the through holesin the frame sectionsof the terminal platesand the through holein the frame plate

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Takasaki, Japan

Yuki Kawai