Panasonic Intellectual Property Management Co., Ltd.

Sakura Color Products Corporation

Panasonic Corporation

Yuki Inoue

Tatsuya Arisawa

Yuki Kitai

Masahiro Yasunaga

Shunji Araki

Shigeyuki Takao

Masao Yoshikawa

Yuki Tokuda

Tomoyuki Abe

Shun Yamaguchi

Fumito Suzuki

Hirohisa Goto

Akira Irifune

A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less. In Formula (1), Z represents an arylene group, Rto Reach independently represent a hydrogen atom or an alkyl group, and Rto Reach independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Copper-clad laminate, wiring board, and copper foil with resin

A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.

Copper-clad laminate, wiring board, and copper foil provided with resin

Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 &#x3bc;mol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 &#x3bc;m or less in ten-point average roughness Rz.

Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board

A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25&#xb0; C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 &#x3bc;m or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt. 

Metal-clad laminate and metal foil with resin

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 &#x3bc;m or less.

Metal-clad laminate, metal member with resin, and wiring board

Ballpoint pen

Eyeglasses

Growing community of inventors

Fukushima, Japan

Yuki Inoue