Lintec Corporation

Arakawa Chemical Industries, Ltd.

Fujimori Kogyo Co., Ltd.

Yuki Eto

Takashi Akutsu

Kazuyuki Tamura

Tomohide Hukuzaki

Toyoaki Suzuki

Mihoko Yoshida

Atsushi Takematsu

Kosuke Kashima

Asako Kanazawa

To provide a tubular container which has non-absorbing properties with respect to contents as well as gas barrier properties. A tubular containercomprises at least an outlet unitprovided with an outlet partthrough which contents are dispensed and a shoulder partthat extends radially outward from the outlet part; and a body partthat is welded to the shoulder partof the outlet unitand stores the contents therein, wherein the body partcomprises at least an innermost layer formed from a non-absorbing resin on an inner side that comes into contact with the contents, an outermost layer formed on an outermost side, and an intermediate layer formed between the innermost layer and the outermost layer and including a gas barrier layer. This tubular containeris characterized by a structural form wherein all surfaces coming into contact with the contents are formed from a non-absorbing resin or a structural form with a transparent body part including a gas barrier layer.

Tubular container

The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Base film and pressure-sensitive adhesive sheet provided therewith

To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Growing community of inventors

Tokyo, Japan

Yuki Eto