Samsung Electronics Co., Ltd.

Other

Aict (advanced Institutes of Convergence Technology)

Yukeun Eugene Pak

Geunbae Lim

Jung Hyun Lee

Hayong Yun

Sung-jin Kim

Jong Up Jeon

Young Kuk

Hyunjung Shin

Jung-sang Ko

Sungjin Kim

Yong-Hee Cho

Munbo Shim

Example embodiments relate to a green-light emitting device including a quaternary quantum well on a vicinal c-plane. The light-emitting device includes a substrate having a vicinal c-plane surface and a light-emitting layer on the vicinal c-plane surface of the substrate. The light-emitting layer includes a quantum well layer of AlInGaN and quantum barrier layers of InGaN disposed on and under the quantum well layer respectively, and 0&#x3c;x&#x3c;1, 0&#x3c;y&#x3c;1, and 0&#x3c;z&#x3c;1.

Green-light emitting device including quaternary quantum well on vicinal c-plane

A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM probe having a source, channel, and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.

Method of fabricating a probe of a scanning probe microscope (SPM) having a field-effect transistor channel

A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM prove having a source, channel and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.

Scanning probe microscope (SPM) probe having field effect transistor channel and method of fabricating the same

A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the upper or lower board, and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the upper or lower board. Accordingly, a thin and small cooling device capable of performing cooling without external power can be obtained. Also, various modifications of a simple micro channel attached to an evaporator eliminate a resistance on a flow path produced by an increase in the specific volume of a working fluid due to the phase change of the working fluid, and prevent a backward flow of the working fluid due to a rapid increase in pressure. Therefore, the entire cooling system can have hydrodynamic instability.

Cooling device using capillary pumped loop

A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

Cooling device with micro cooling fin

Growing community of inventors

Seongnam, South Korea

Yukeun Eugene Pak