Kansai Paint Company, Ltd.

Yukari Takeda

Naozumi Iwasawa

Hideo Kogure

Genji Imai

Keisuke Naruse

A positive type anionic electrodeposition photoresist composition comprising, as a main component, a dispersion obtained by neutralizing, with a base, a mixture comprising: (A) an acrylic resin containing carboxyl group(s) and hydroxyl group(s), (B) a vinylphenol resin containing a hydroxystyrene unit in an amount of at least 25% by weight based on the resin, and (C) an ester between a polyhydroxybenzophenone and 1,2-naphthoquinone diazide sulfonic acid or benzoquinone diazide sulfonic acid, and dispersing the resulting neutralization product in water. This composition is superior in running stability during electrodeposition and is useful for formation of highly reliable resist pattern or conductor pattern.

Positive type anionic electrodeposition photo-resist composition and

The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method. The process comprises making throughholes in a substrate having an electro-conductive layer on each side; conducting plating on at least the walls of the substrate throughholes; forming a photosensitive resist film on each side of the substrate; applying an actinic radiation onto the resist film by a direct drawing method in the shape of a pattern to be obtained when the resist film is a negative type, or in the shape of a pattern reverse to a pattern to be obtained when the resist film is a positive type; forming, on the uncoated portion inside the throughholes by electrodeposition, an electrodeposition film which is insoluble in a developing solution used later and an etching solution used later but is removable with a peeling solution used later; conducting development with an appropriate developing solution to remove the resist film; removing the exposed plating layer portion and the electro-conductive layer portion present therebeneath, by etching; and then peeling the remaining resist film and the electrodeposition film inside the throughholes, with an appropriate peeling solution.

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Hiratsuka, Japan

Yukari Takeda