Applied Materials, Inc.

Yukari Nishimura

Joseph Frederick Sommers

Sio On Lo

Samantha S H Tan

Michael E Wilmer

Jianqi Wang

Terry P Reiss

Anbei Jiang

Sherry Cordova

Natalia Kroupnova

William Ming-ye Lu

Rajan Balesan

Clari Nolet

Liyuan Bao

Richard C Lyon

Woon Young Toh

Terry Lee Doyle

Evgueni Lobovski

Inna Louneva

William Ming-Ye Lu

A processing chamber component and method for fabricating the same are provided. The processing chamber component is fabricated in the manner described herein and includes the creation of at least a macro texture on a surface of the chamber component. The macro texture is defined by a plurality of engineered features arranged in a predefined orientation on the surface of the chamber component. In some embodiments, the engineered features prevent formation of a line of sight surface defined between the features to enhance retention of films deposited on the chamber component.

Geometries and patterns for surface texturing to increase deposition retention

Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/&#x2212;2% HF or buffered HF acid, 3.8%+/&#x2212;0.5% NHF pH buffer, 59.7%+/&#x2212;5% ethylene glycol, and the balance HO.

Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates

The present invention provides a semiconductor processing device () including a tool () having one or more sensors, a primary data communication port () and a secondary data communication port (). A sensor data acquisition subsystem () acquires sensor data from the tool via the secondary port (). The data acquisition subsystem () acquires MES operation messages via the primary port (). Sensor data are communicated to a sensor processing unit () of a sensor data processing subsystem (). The sensor processing unit () processes and analyzes the sensor data. Additionally, the processing unit () can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility () including a plurality of tools () each having a primary data communication port () and a secondary data communication port ().

Wafer fabrication data acquisition and management systems

Growing community of inventors

Sunnyvale, CA, United States of America

Yukari Nishimura