J-devices Corporation

Yukari Imaizumi

Hiroshi Inoue

Akio Katsumata

Yoshihiko Ikemoto

Hiroaki Matsubara

Kiminori Ishido

Goshi Kawazu

Isao Kudo

Yoichi Hiruta

A semiconductor device including: a support plate; a semiconductor chipmounted on one principal surface of the support platevia an adhesive layer, with the element circuit surface of the chip being directed upward; an insulation material layerthat seals the semiconductor chipand the periphery of the semiconductor chip; openings formed on an electrode arranged on the element circuit surface of the semiconductor chipin the insulation material layer; conductive portionsformed in the openings so as to be connected to the electrode of the semiconductor chip; a wiring layerformed on the insulation material layerso as to be connected to the conductive portionsand partially extending to the peripheral region of the semiconductor chip; and external electrodesformed on the wiring layer

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.

Semiconductor device

Growing community of inventors

Yokohama, Japan

Yukari Imaizumi