Central Glass Company, Limited

Yukari Hara

Haruhiko Komoriya

Yoshiharu Terui

Kenji Hosoi

Kensuke Hirotaki

Fumito Kobayashi

Ikunari Hara

Hiroshi H Eguchi

Kei Matsunaga

Hiroto Hori

Yosuke Murakami

Ayumi Yamaguchi

Hirokatsu Nagura

A polyimide which is obtained by a reaction of an aromatic diamine having a 1,1,1-trifluoro-2,2-ethanediyl group (—C(CF)H—), as a linkage skeleton, with a tetracarboxylic dianhydride is easily dissolved in an organic solvent and exhibits excellent film forming properties. In addition, the thus-obtained polyimide can be used for an optical film and a display device.

Polyamide acid, polyimide, optical film, display device and production methods thereof

A curable resin represented by General Formula (1). In General Formula (1), Reach independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R's are each independently a monovalent group including a polymerizable functional group.

Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin

A film-forming composition according to the present invention includes: a fluororesin having a repeating unit of the formula (1) and a repeating unit of the general formula (2); and a fluorine-containing solvent. In the general formula (2), Rrepresents a C-Cstraight, C-Cbranched or C-Ccyclic hydrocarbon group in which at least one hydrogen atom may be replaced by a fluorine atom or chlorine atom and which may have a hydroxy group. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element as the composition can form a fluororesin film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.

Composition for forming films, film produced from said composition, and method for producing organic semiconductor element using said composition

A film-forming composition according to the present invention include fluororesin having a repeating unit of the general formula (1); and a fluorine-containing solvent. In the general formula (1), Reach independently represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; and Reach independently represents C-Cstraight, C-Cbranched or C-Ccyclic fluorine-containing hydrocarbon gr which any hydrogen atom may be replaced by a fluorine atom with the proviso that the repeating unit contains at least one fluorine atom. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element because the composition can form a film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.

Film-forming composition, film formed thereby, and method for manufacturing organic semiconductor element using same

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Fujimino, Japan

Yukari Hara