Dai Nippon Printing Co., Ltd.

Yuka Tachikawa

Hiroyoshi Nakajima

Katsuyuki Motai

Masahiro Imai

Taku Muneda

Kazushi Sato

A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base, barrier, second resin base, resin, and sealant layers are laminated in that order. A resin layer indentation elastic modulus is smaller than an indentation elastic modulus of each of the first and second resin base layers by one or more orders of magnitude, a sealant layer indentation elastic modulus is smaller than a first resin base layer indentation elastic modulus of and a second resin base layer indentation elastic modulus by one or more orders of magnitude, and a difference between the first resin base layer indentation elastic modulus and the second resin base layer indentation elastic modulus is smaller than a difference between the second resin base layer indentation elastic modulus and the indentation elastic modulus of the resin layer.

Sealant, bag for transporting and packaging of silicon material

An outer packing material for vacuum insulation material by having a thermally weldable film and a gas barrier film in this order; wherein the product of the tensile elasticity of the outer packing material for vacuum insulation material and the cube of a thickness of the outer packing material for vacuum insulation material is 3.0 MPa&#xb7;mmor less; and push-in elasticity of the thermally weldable film is 0.8 GPa or more.

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Tokyo-to, Japan

Yuka Tachikawa