Nikon Corporation

Sumitomo Bakelite Company Limited

Yuka Ito

Daisuke Fujiwara

Natsuki Makino

Masayoshi Kondo

Haruhiko Fujisawa

According to one embodiment, a profile measuring apparatus comprises a profile measuring unit, a position acquiring unit, a profile calculating unit, a deflection detecting unit, and a controlling unit. The profile measuring unit has a projecting unit to project a pattern onto a measured object, and an imaging unit to image the pattern. The position acquiring unit acquires a position of the profile measuring unit. The profile calculating unit calculates a profile of the measured object, based on image information from the imaging unit and position information from the position acquiring unit. The deflection detecting unit detects deflection of the projecting unit. The controlling unit executes active correction for the profile measuring unit and/or passive correction for the profile calculating unit, based on the deflection of the projecting unit detected by the deflection detecting unit.

Profile measuring apparatus

A circuit board () exhibits an average coefficient of thermal expansion (A) of the first insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.

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Tokyo, Japan

Yuka Ito