Toshiba Memory Corporation

Yuka Akahane

Masayuki Miura

Soichi Homma

Masatoshi Fukuda

Naoyuki Komuta

Yukifumi Oyama

Yuji Karakane

A semiconductor device includes a wiring substrate having a first surface, a stacked body on the first surface, the stacked body comprising a first chip, a second chip having a through via and positioned between the first chip and the first surface, and a third chip, a first resin contacting the first surface and the third chip, and a second resin sealing the stacked body. The first and second resins are made of different materials.

Growing community of inventors

Yokkaichi, Japan

Yuka Akahane