Boe Technology Group Co., Ltd.

Macau University of Science and Technology

Honeywell International Inc.

Hewlett Packard Enterprise Development LP

Beijing Boe Technology Development Co., Ltd.

Yujun Zhang

Chao Liu

Lei Chen

Jing Yu

Liang Zhou

Zhijun Xu

Li Feng

Zengsheng He

Zhongyuan Sun

Rui Zhang

Dejiang Zhao

Yanan Niu

Lu Wang

Qinglin Zhao

Jinqian Wang

Xiaochen Zhou

Xiaohu Tang

Zhuxun Wang

Youhua Cai

Rongchang Duan

Hanwen Zhang

Zhongcheng Li

Julong Feng

An array substrate, a display panel and a manufacturing method thereof are provided. The array substrate includes a base substrate including a peripheral region; and a lead region located in the peripheral region, the lead region including a plurality of leads, wherein a main plane of the base substrate provided with the plurality of leads includes a first side edge, and the plurality of leads extend to the first side edge, a lateral surface of the base substrate at the first side edge is provided with a concave portion, and an electrode electrically connected with the plurality of leads is disposed in the concave portion.

Array substrate, display panel and manufacturing method thereof

The present disclosure relates to a display panel and a method for manufacturing a display panel. The display panel includes a first substrate having a first wiring, a second substrate having a second wiring, the first substrate, and the second substrate being laminated on each other to form a laminated structure, and a third wiring located on a side surface of the laminated structure, wherein the third wiring connects the first wiring and the second wiring.

Display panel and method for manufacturing display panel

Examples relate to a method and a device for wireless access authentication. The method is applied to an intelligent gateway which is previously associated with account information of a user. The intelligent gateway may receive an access authentication packet comprising an authentication identification indicating a terminal device; the intelligent gateway may construct an identity verification packet comprising an authentication identification indicating the terminal device and an association account identification indicating an account registered on the intelligent gateway; the intelligent gateway may send the identity verification packet to a cloud server; the intelligent gateway may permit a terminal device corresponding to authentication identification carried in a verification success packet returned by the cloud server to pass the access authentication.

Wireless access authentication

A film structure includes a first metal layer, a second metal layer, and an insulation layer located between the first metal layer and the second metal layer. In at least a portion of an edge region of the film structure, the first metal layer extends outwards relative to an edge of the insulation layer by a first predetermined length, and the insulation layer extends outwards relative to an edge of the second metal layer by a second predetermined length. In this way, when the film structure is measured, a fall value between the surface, adjacent to the second metal layer, of the insulation layer and the surface, adjacent to the insulation layer, of the first metal layer is measured by means of a motion trajectory of the measuring probe at the time of ascending or descending, thereby obtaining a more accurate thickness value of the insulation layer.

Film structure and its measuring method, display substrate and its measuring method and manufacturing method

A method for evaluating performance of a data communication network with a receiver node arranged to initiate data transmission thereto from a plurality of transmitter nodes directly connected therewith includes applying to the data communication network a stochastic operation model arranged to model operation characteristics of the receiver node, and determining throughput or power consumption of the network based on the stochastic operation model. The operation characteristics include: a duration of a work cycle of the receiver node (T), the work cycle including an active data communication period (T) and an inactive period (T); a duration of the active data communication period (T), the active data communication period including a number of data communication events; the number of data communication events in the work cycle n; a duration of the respective data communication events (T); and amount of data successfully received at the receiver node in the work cycle (B).

Method for evaluating performance of a data communication network

A method for implementing a packet I/O engine on a programmable computing platform is provided, where the engine performs I/O functions for plural threads generated by a plurality of user applications. In the method, the platform is configured such that only one thread is permitted to initialize and configure the resources. Furthermore, I/O-device queues each for buffering packets either transmitted to or received from an individual external I/O device are set up. For a plurality of unsafe I/O-device queues determined, among the I/O-device queues, to be multi-thread unsafe, a plurality of multi-producer, multi-consumer software queues for buffering packets delivered between the plurality of the unsafe I/O-device queues and the plurality of user applications is set up. In particular, the plurality of multi-producer, multi-consumer software queues is configured such that the unsafe I/O-device queues are collectively synchronized to maintain data consistency in packet delivery in the presence of multiple threads.

High-efficient packet I/O engine for commodity PC

Compute-intensive packet processing (CIPP) in a computer system comprising a programmable computing platform is accelerated by using a packet I/O engine, implemented on the platform, to perform packet I/O functions, where the packet I/O engine is configured to achieve direct access to a network interface card (NIC) from a user application. For a Linux-based computer system, standard I/O mechanisms of Linux are bypassed and only the packet I/O engine is used in performing the I/O functions. Furthermore, the computer system is configured to: process a batch of packets, instead of packet by packet, in every function call; and when moving a packet between a buffer of an individual user application and a queue of the packet I/O engine, copy a packet descriptor of the packet instead the entire packet. In addition, workflows across different working threads are balanced and parallelism is exploited to fully utilize resources of the platform.

PacketUsher: accelerating computer-intensive packet processing

A device for film thickness measurement and a method for film thickness measurement are disclosed. The device includes a planar indenter, a collecting unit and a processing unit. The planar indenter includes a base plate and a piezoelectric film layer. The collecting unit includes a plurality of collecting circuits evenly distributed above the piezoelectric film layer and spaced from each other. The collecting circuits are used for collecting current signals generated when the piezoelectric film layer deforms at positions corresponding to the collecting circuits. The processing unit is used for calculating a film thickness of the film sample to be measured based on the current signals collected by each of the collecting circuits.

Device for film thickness measurement and method for film thickness measurement

A method of manufacturing a low temperature polycrystalline silicon thin film and a thin film transistor, a thin film transistor, a display panel and a display device are provided. The method includes: forming an amorphous silicon thin film () on a substrate (); forming a pattern of a silicon oxide thin film () covering the amorphous silicon thin film (), a thickness of the silicon oxide thin film () located at a preset region being larger than that of the silicon oxide thin film () located at other regions; and irradiating the silicon oxide thin film () by using excimer laser to allow the amorphous silicon thin film () forming an initial polycrystalline silicon thin film (), the initial polycrystalline silicon thin film () located at the preset region being a target low temperature polycrystalline silicon thin film (). The polycrystalline silicon thin film has more uniform crystal size.

Method of manufacturing low temperature polycrystalline silicon thin film and thin film transistor, thin film transistor, display panel and display device

This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.

Array substrate wiring and the manufacturing and repairing method thereof

Embodiments of the present invention disclose a bended liquid crystal display and a manufacturing method and apparatus therefore. The method comprises: preparing an array substrate and a color filter substrate with flat glass sheets having different thermal expansion coefficients; applying adhesive sealant at edges of surfaces of the array substrate and/or the color filter substrate; heating the array substrate and the color filter substrate, and binding the expanded array substrate and color filter substrate together, to form an assembled substrate; and cooling the assembled substrate and forming a bended assembled substrate having a degree of curvature. The bended liquid crystal display has a better stability, and has no variation in its degree of curvature over service time.

Bended liquid crystal display and its manufacturing method and apparatus

A process assembles and/or reassembles a software application. In an embodiment, assemblies are loaded from an architecture description markup language (ADML) document. Class objects and type objects are activated based on the ADML document. Components and connectors are created based on the ADML document. The components are serialized, and an architecture is assembled based on connections described in the ADML document. A main active component designated in the ADML document is then activated.

Growing community of inventors

Beijing, China

Yujun Zhang