Iriso Electronics Co., Ltd.

Yujiro Sugaya

Tomomitsu Saito

Yuki Asanuma

Takanori Kimata

Kazunari Kusaka

Michitoshi Mitani

An electrical device includes a board, an electrical component bonded to the board by soldering, and a resin section that retains the board and the electrical component. The resin section is formed by insert molding with the board and the electrical component as inserts. A resin for configuring the resin section is a thermoplastic resin. A melting temperature of the resin for configuring the resin section is higher than a melting temperature of a solder for bonding the electrical component to the board.

Electrical device

To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board includes a substrate including a hole portion that penetrates the substrate in a plate thickness direction, and a connector region including a first conductor layer that closes one side of the hole portion, liquid metal disposed in a recess formed by the hole portion and the first conductor layer, and a sealing layer that is the liquid metal cured on a liquid surface side. The liquid metal may be in contact with a second conductor layer formed in the recess.

Circuit board and circuit device

A surge absorbing structure capable of effectively utilizing the gaseous discharge is intended without a complicated structural configuration such as using the conventional discharge tube. To implement this, a porous layer 1 is formed by a non-conductive material to provide many holes, and sandwiched between a pair of electrodes 2a and 2b to allow the electrodes to be conducted by the gaseous discharge generated through the holes 3 in this porous layer to execute surge absorption.

Growing community of inventors

Kanagawa, Japan

Yujiro Sugaya