Ricoh Company, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Hitachi, Ltd.

Fuji Photo Film Company, Limited

Yujiro Kaneko

Katsuyuki Yamada

Hiroko Iwasaki

Yuki Nakamura

Yusuke Takagi

Eiji Noda

Kenichi Aihara

Yoshio Kawai

Tokihito Suwa

Nobutake Tsuyuno

Yukio Ide

Takahiro Shimura

Toshiaki Ishii

Hiroshi Deguchi

Michiaki Shinotsuka

Makoto Harigaya

Yoshiyuki Kageyama

Shinichi Fujino

Hiromi Shimazu

Hitoshi Nakamura

Eiichi Ide

Akira Matsushita

Kazuhiro Suzuki

Toshio Hori

Masahide Harada

Wasaburo Ohta

Hajime Yuzurihara

Hisashi Tanie

Akihiro Sato

Satoshi Hirano

Junpei Kusukawa

Maki Ito

Atsuyuki Watada

Masanori Miyagi

Katsunari Hanaoka

Fumiya Ohmi

Kyohji Hattori

Masahiko Asano

Hideto Yoshinari

Takayuki Fukuzawa

Michihisa Takahashi

Yasuo Sawada

Isao Miyamoto

Masato Higuma

Shinji Hiramitsu

Xudong Zhang

Takehide Yokozuka

Hajime Machida

Shinichi Fujiwara

Keiichi Uraki

Masashi Nakazawa

Masashi Yura

Fumiya Omi

Osamu Ikeda

Kiyoto Shibata

Toru Kato

Masaaki Ishiyama

Michiaki Shinozuka

Shota Funato

Toshihiko Yoshio

Yuuzi Onodera

Hiroshi Fujisaki

Eiji Tadano

Hiroyuki Reciente Chigasaki 408 Iwasa

A semiconductor device includes: a semiconductor element; and a first conductor and a second conductor respectively joined to a first surface and a second surface of the semiconductor element via Sn-based solder, in which a Ni-based plated layer is formed on surfaces of the first conductor and the second conductor that oppose the Sn-based solder and on the first surface and the second surface of the semiconductor element, and an interface reaction inhibition layer made of (Cu, Ni)Snand having a layer thickness of 1.2 to 4.0 μm is formed at an interface between the Ni-based plated layer and the Sn-based solder.

Semiconductor device with first and second conductors and plated layer and method for manufacturing semiconductor device

Provided is an electric circuit body including: a power semiconductor element; a first conductor plate configured to be connected to one surface of the power semiconductor element; a first sheet-shaped member having a first resin insulation layer and configured to at least cover a surface of the first conductor plate; a sealing material configured to seal each of the power semiconductor element, the first conductor plate, and an end of the first sheet-shaped member; and a first cooling member configured to be adhesively attached to the first sheet-shaped member. In the electric circuit body, the first sheet-shaped member includes: an embedded portion where the end of the first sheet-shaped member is covered with the sealing material; a heat dissipation surface as a region to overlap the surface of the first conductor plate; and a margin as a region between the embedded portion and the heat dissipation surface, the margin is located more inward than the heat dissipation surface, and the embedded portion is located more inward than the margin.

Electric circuit body, power conversion device, and method for manufacturing electric circuit body

A power module includes a first conductor plate to which a first power semiconductor element is bonded, a second conductor plate to which a second power semiconductor element is bonded, the second conductor plate being disposed adjacent to the first conductor plate, a first heat-dissipating member disposed counter to the first conductor plate and the second conductor plate, and a first insulating sheet member disposed between the first heat-dissipating member and the first conductor plate. The first power semiconductor element is disposed at a position at which a first length from an end of the first conductor plate, the end being closer to the second conductor plate, to the first power semiconductor element is larger than a second length from an end of the first conductor plate, the end being far from the second conductor plate, to the first power semiconductor element, and the second length is larger than the thickness of the first conductor plate.

Power module

A power conversion device including: a semiconductor device; a first water channel and a second water channel stacked in a predetermined stacking direction and installed with the semiconductor device interposed therebetween; and a connecting water channel connecting the first water channel and the second water channel, in which the connecting water channel is formed by joining and fixing a joint member joined to the first water channel and the second water channel and a cover member separate from the joint member to each other, the first water channel and the second water channel are joined to the joint member by a joint formed in a plane parallel to the stacking direction, and the cover member covers the joint and is joined and fixed to the joint member.

Power conversion device and method for manufacturing power conversion device

A problem is that close contact with a heat dissipation surface of a power semiconductor device is not sufficient, and thus heat dissipation performance is low. A thermally conductive layerabuts on a heat dissipation surfaceof a circuit body, and a heat dissipation memberabuts on the outside of the thermally conductive layer, which is a side of the heat dissipation surfaceof the circuit body. A fixing memberabuts on a side of the circuit bodyopposite to the heat dissipation surface. A connection memberis penetrated at the respective end portions of the heat dissipation memberand the fixing member. FIG.illustrates a state before a bolt and a nut of the connection memberare tightened. The heat dissipation memberholds a curved shape such that the central portion of the heat dissipation memberprotrudes toward the circuit body. The bolt and the nut of the connection memberare fastened and fixed at both ends of the heat dissipation memberand the fixing memberso as to sandwich the circuit body. The heat dissipation memberis elastically deformed to bring the heat dissipation memberinto close contact with the heat dissipation surfaceof the circuit bodyvia the thermally conductive layer, and surface pressure is applied from the heat dissipation memberto the heat dissipation surface

Power semiconductor device and manufacturing method of power semiconductor device

A power semiconductor device includes an insulating substrate on which a first conductor layer is arranged on one surface, a first conductor that is connected to the first conductor layer via a first connecting material, and a semiconductor element that is connected to the first conductor via a first connecting material. When viewed from a direction perpendicular to an electrode surface of the semiconductor element, the first conductor includes a peripheral portion formed larger than the semiconductor element. A first recess is formed in the peripheral portion so that a thickness of the first connecting material becomes thicker than other portions.

Power semiconductor device

A semiconductor module includes a semiconductor device that includes first and second fin bases having first and second connecting portions and a resin for sealing the outer peripheral side surfaces of first to fourth conductors, and a flow path forming body connected to the first and second connecting portions of the first and second fin bases. A first elastically deformed portion, which is elastically deformed, is provided such that a distance in a thickness direction between the outer peripheral ends of the first and second connecting portions becomes smaller than a distance in a thickness direction between intermediate portions of the first and second connecting portions. The resin is filled between the first and second connecting portions of the first and second fin bases are filled with the resin therebetween.

Semiconductor module, power conversion device, and manufacturing method of semiconductor module

Reliability is to be improved. A control boardon which an electronic componentis mounted and an enclosurein which the control boardis sealed with sealing resinare included, wherein the enclosurehas a shape in which a volume of resin on one surface side of the control boardis larger than a volume of resin on the other surface side, a gate markis formed in the enclosure, a length of the gate markin a thickness direction of the control boardis larger than a thickness of the control board, the control boardis located such that a side surface partially overlaps a projection region of the gate mark, and the control boardis arranged toward the other surface side relative to a center of the gate mark

Electronic control unit and method for manufacturing electronic control unit

A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

Power semiconductor device and power conversion device

Provided is an electronic control device that can be reduced in size and weight and can maintain high reliability even under a severe environment. The electronic control device includes: a control substrate; a connector having one end connected to the control substrate and the other end connected to an external terminal; and a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate,

Electronic control device

Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.

Electronic control device, and manufacturing method for vehicle-mounted electronic control device

Provided is a highly reliable electronic control device which has not only an effect of reducing costs but also an effect of facilitating a manufacturing process. To include a control board; a connector including a terminal connected to the control board; and a housing case to which the control board and the connector are fixed. The control board has a part sealed with a sealing resin. The connector is disposed at a position facing another part of the control board, being isolated from the sealing resin by the control board and the housing case.

An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.

Resin-sealed vehicle-mounted control device

Provided are a driver and a driver-integrated electric actuator that can suppress a temperature rise of the driver integrated with an electric actuator. A driver circuit of an electric actuator-integrated driver controls a current to be supplied to an electric actuator. A metal member (heat-conducting portion) conducts heat generated in the driver circuit. A driver sealing portion is fixed to the electric actuator and seals the driver circuit and the metal member. The metal member is extended to the electric actuator.

Driver and driver-integrated electric actuator

Providing an electronic control device excellent in reliability with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin; a terminal for electrically connecting the control substrate with an external device; and a fixing plate for positioning and fixing the terminal with respect to the housing case. After the terminal is fixed to the housing case by the fixing plate, the terminal is electrically connected to the control substrate and subsequently a portion of the terminal and the control substrate are sealed with the sealing resin.

Electronic control device and manufacturing method for same

Growing community of inventors

Hitachinaka, Japan

Yujiro Kaneko