Sharp Kabushiki Kaisha Corporation

Sanyo Electric Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Other

Mitsubishi Denki Kabushiki Kaisha

Mitsuboshi Belting Ltd.

Onkyo Corporation

Panasonic Corporation

Kobe Steel, Ltd.

Ryoden Semiconductor System Engineering Corporation

Kobelco Research Institute, Inc.

Lng Japan Corporation

Yuji Yamamoto

Hisao Okada

Takeshi Takarada

Toshihiro Yanagi

Tadatsugu Nishitani

Yuichi Yokoyama

Hiroshi Matsuo

Takuji Oda

Shinya Inoue

Kiyoshi Maeda

Toshiyuki Nohma

Fumitaka Ogasawara

Takashi Takehira

Tatsuo Koga

Toshihiro Ueda

Nobuyuki Kamikihara

Ryosuke Ohtsuki

Keitaro Fujii

Masaru Akamatsu

Hiroshi Isago

Satoru Matsumoto

Masashi Kinoshita

Koji Nishio

Yasunobu Tagusa

Nobuhiro Furukawa

Toshihiko Saito

Kuniaki Tanaka

Takehiko Ito

Yoshiaki Onaka

Sunao Etou

Yukio Mori

Masahiro Inoue

Eiji Takahashi

Hiroki Okada

Seiji Yoshimura

Hiroshi Kurokawa

Masayuki Takahashi

Hiroshi Kawahara

Makoto Nishimura

Koso Matsuno

Kazuya Kondoh

Teppei Iwase

Shigeru Shirai

Masato Kannaka

Shigeyuki Uehira

Toshihiko Wada

Yoshifumi Takasu

Daisuke Kobayashi

Takao Moriwaki

Akihisa Yamada

Kosei Maemura

Kiyoshi Inada

Yoshihiro Shoji

Nobuhiro Nishiguchi

Takuya Sato

Yoshikazu Mihara

Mayumi Uehara

Michirou Yoshino

Makoto Miyago

Takashi Nakashima

Masakazu Kajita

Hideki Ohno

Shinji Fujii

Mitsuyoshi Seo

Yoshiharu Shimada

Keiichi Tsujioku

Mikio Hashimoto

Kunio Iba

Junichi Kamatani

Hiroshi Shimokawa

Toru Furushige

Tooru Furushige

Takaaki Kobayashi

Tomoko Ishida

Yoshihiro Hattori

Hidemi Akiyama

Yoshiko Kurimoto

Minoru Fujimoto

Toru Ueno

Jingo Takemura

Norio Iwai

Kenji Imanishi

Noriaki Watanabe

Kazuhiko Takenaka

Hirofumi Komoto

A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.

Polishing apparatus and polishing method

A method for manufacturing a film structure includes: a positional deviation amount detection process of detecting an amount of positional deviation related to a relative position of a second cured film formed on a rear surface of a film with respect to a first cured film formed on a front surface of the film; a relative position adjustment process of correcting a position or a rotation speed of a second transfer roll to adjust the relative position such that the amount of positional deviation detected in the positional deviation amount detection process is reduced; a first tensile force detection process and a second tensile force detection process of respectively detecting a tensile force of the film between a first pressurizing roll and a second pressurizing roll before and after the relative position adjustment process; and a tensile force adjustment process of adjusting the tensile force of the film such that the tensile force of the film detected in the second tensile force detection process approaches the tensile force of the film detected in the first tensile force detection process.

Method and apparatus for manufacturing film structure

A film structural member includes a recessed portion on a transparent substrate, metal wiring on a base of the recessed portion, and a particle layer on the metal wiring. The particle layer is configured as an aggregate of particles having an average particle diameter of 300 nm or smaller.

Film structural member

An induction heating cooker includes an inverter for supplying a current to a heating coil, a control portion for driving the inverter, an electrostatic capacitance detecting portion for measuring electrostatic capacitance of a plurality of electrodes, and a boiling over detecting portion. The boiling over detecting portion reduces an output of the inverter from a first set value to a second set value after a sensed value of the electrostatic capacitance is within a first variation range (&#x394;V) or more, and returns the output of the inverter to the first set value when a sensed value during a boiling over establishing period (T) performed after the sensed value has reached the first variation range or more and falls within a second variation range (&#x394;V).

Induction heating cooker

The present invention is a method of manufacturing a fine structure body which manufactures the fine structure body by repeating a basic fine structure body forming step that forms a basic fine structure body by pressing a fine structure mold against a curable resin (photocurable resin film) on a surface of a base material and a release and moving step that releases the fine structure mold from the base material and moves the fine structure mold, wherein the fine structure mold includes at least a first mold depression pattern which is disposed at center area of it, and a second mold depression pattern which is disposed in at least one side part in circumference area of it, and a size of the second mold depression pattern is smaller than a size of the first mold depression pattern.

Method of manufacturing fine structure body and fine structure mold

The disclosed induction heating cooking device includes a boiling-over detection portion which is adapted to reduce heating output from an inverter to a pre-set value if the amount of change of a capacitance detected by a capacitance detection portion from a reference value (Vo) is equal to or more than an output reduction threshold value (&#x394;V), and further is adapted to stop heating, if the amount of change is equal to or more than an output stop threshold value (&#x394;V). In this case, the output stop threshold value is provided for each of the plurality of the electrodes, which can absorb impedance variations in the plurality of the electrodes formed through pattern printing using conductive films, thereby uniformizing their sensitivity to boiling over in any directions.

Induction heating cooking device

A rotational misalignment between semiconductor wafers constituting a bonded wafer is calculated. A light source is arranged at a position which is on a front side of an opening of a notch and which is separated from an outer edge portion of a bonded wafer by a predetermined interval, and outputs light to irradiate the outer edge portion of the bonded wafer including the notch. A camera receives and photoelectrically converts reflected light that is specularly-reflected by the outer edge portion of the bonded wafer including the notch among the light outputted by the light source in order to output a brightness distribution of the reflected light as an image. A computer analyzes positions of notches from the image outputted by the camera to obtain a notch position misalignment, and further calculates a rotational misalignment between semiconductor wafers using a center position misalignment between the semiconductor wafers.

Rotational misalignment measuring device of bonded substrate, rotational misalignment measuring method of bonded substrate, and method of manufacturing bonded substrate

An induction heating cooker includes a boiling over detecting portion that reduces the heating output of an inverter to a predetermined value when a change amount of an electrostatic capacitance detected by a capacitance detecting portion with respect to a reference value is equal to or greater than a threshold value. The boiling over detecting portion stops a heating action or reduces the heating output to a third set value lower than a second set value when a change rate of the capacitance is equal to or greater than a predetermined change rate, and maintains the heating output at the second set value when the change rate of the capacitance is less than the predetermined change rate, during a boiling over determining period started from the time that the change amount of the capacitance with respect to the reference value is equal to or greater than the output reducing threshold value.

Induction cooker and method of operation

A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Method and device for peeling off silicon wafers

An AV amplifier detects combinations of resolutions and vertical frequencies of input video data, and reads information about combinations of resolutions and vertical frequencies stored in a display device in advance. The AV amplifier sets values, that are a combination of an output resolution and an output vertical frequency in which a value obtained by dividing a vertical frequency of the video data detected by a video detecting section by the output vertical frequency is an integer number and are present in the combinations of the resolutions and the vertical frequencies read by the reading section, as the combination of the output resolution and the output vertical frequency.

Video processing apparatus

A repeater device comprises a determining section for determining whether the authentication with the sink device fails continuously for a predetermined time or more; a repeater information rewriting section for, when the determination is made that the authentication with the sink device has failed continuously for the predetermined time or more, rewriting the repeater information stored in the storage section into information indicating the sink device; and a second authenticating section for causing the source device to obtain the repeater information rewritten into the information indicating the sink device, and causing the source device to authenticate the repeater device.

Repeater device

A linear heater is formed of an enamel wire composed of a heating wire and an enamel layer. The heating wire is made of a copper alloy containing silver, for example. The enamel layer is made of polyester imide (PEI), polyimide (PI) or polyamide imide (PAI), for example. The enamel layer is coated with an insulating coating layer. The insulating coating layer is made of fluororesin such as perfluoroalkoxy mixture (PFA), polyimide (PI), or polyamide imide (PAI). The linear heater is bonded to the lower surface of an upper toilet seat casing such that it is sandwiched between a metal foil and a metal foil made of aluminum, for example.

Toilet seat apparatus

An aspect of the invention provides a commercial detection apparatus for detecting commercials that includes a silent detector configured to detect a silent segment based on the strength of the audio signal output in content, and a determination unit configured to determine a sound segment as a commercial if three or more silent segments are detected essentially within a set time span, and if the sound segment is found between two of the three silent segments.

Commercial detection apparatus and video playback apparatus

Characteristic amounts are calculated from each of multiple musical piece contents, and then time points when the characteristic amounts exceed a threshold are detected as cut points. Information on the cut point concerning each of the multiple musical piece contents is stored. Based on the stored information on the cut point, a judgment is made as to whether the multiple musical piece contents match each other.

Musical piece matching judging device, musical piece recording device, musical piece matching judging method, musical piece recording method, musical piece matching judging program, and musical piece recording program

Provided is a recording or playback apparatus capable of separating a musical piece from an audio including the musical piece and a speech through a simple arithmetic process. A cut point detector detects, as a cut point, a time point at which an audio signal level or an amount of change in the audio signal level is not lower than a predetermined value. A frequency characteristic amount calculator calculates a characteristic amount in a frequency area of the audio signal only at each cut point and in its proximity. A cut point judging unit judges an attribute of the cut point on a basis of the calculated characteristic amount of the frequency. A music section detector detects a start and end points of each music section on a basis of the attribute and an interval between sampling points.

Recording or playback apparatus and musical piece detecting apparatus

Growing community of inventors

Kobe, Japan

Yuji Yamamoto