Toyota Jidosha Kabushiki Kaisha

Tohoku University

Yuji Yagi

Yasushi Yamada

Tadafumi Yoshida

Hiroshi Osada

Kiyohito Ishida

Keiichi Kondo

Takashi Kojima

Makoto Imai

Ikuo Ohnuma

Takashi Atsumi

Yoshikazu Takaku

Ikuo Nakagawa

Mikio Shirai

Naoki Ogawa

There is provided a vehicle seat including: a frame member that structures a frame of a seatback; a pair of supporting members that extend in a seat vertical direction, and that are supported by the frame member at a seat upper side and a seat lower side; a fabric spring member that has elasticity and is stretched between the pair of supporting members; and a spanning member that is provided extending between the pair of supporting members, so as to impart tension to the fabric spring member.

Vehicle seat

A vehicle seat includes a seat cushion frame provided at a seat cushion; a seatback frame structuring a seatback, the seatback frame being rotatably coupled to a front-rear direction rear end portion of the seat cushion frame via a rotation axle; a drive unit disposed at a front-rear direction front side of the seat cushion frame; and a first driving force transmission unit that couples the drive unit with the rotation axle and transmits driving force of the drive unit to the rotation axle.

A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 &#x3bc;m or more but 20 &#x3bc;m or less is provided between the joining surfaces and the three-dimensional web structure.

Junction body, semiconductor module, and manufacturing method for junction body

There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Electronic component

A zinc based solder materialof the present invention is prepared by providing on the surface of a zinc based material, from which an oxide filmhas been removed or at which an oxide filmdoes not exist, with a coating layercontaining primarily a metal whose oxide is more easily reducible than the oxide film. In a joined body and a power semiconductor module of the present invention, the zinc based solder materialis used in the joining portion, and after joining, the coating layerdoes not exist.

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.

Growing community of inventors

Nisshin, Japan

Yuji Yagi