Matsushita Electric Industrial Co., Ltd.

Yuji Yagi

Takeo Yasuho

Michiro Tanaka

Masaaki Hayama

Hiroshi Kohso

Eiji Kawamoto

Makoto Kuwamoto

Masaya Nakatani

Masayuki Mizuno

Kiyoshi Masaki

Tatsuhiko Inagaki

Kazuhiro Miura

Hayami Matsunaga

Yoshihisa Takase

Noboru Mouri

Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.

Circuit board having simultaneously and unitarily formed wiring patterns and protrusions

The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to the thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.

Method of manufacturing semiconductor device

The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.

Manufacturing method of wiring board, and conductive paste used therein

The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.

Method of manufacturing ceramic substrate

An acceleration sensor made available without using a high-level semiconductor technology or a micro-machining technology. The sensor detects an acceleration with a high precision, yet the manufacturing cost is inexpensive. In the sensor, a silicon substrate (,) is used only for a portion with which a strain is caused by an acceleration, while an auxiliary substrate (,A,,B), a cap (,A,,B) and a mass substance (,A,,B) are formed of glass material. Joining of the silicon substrate (,) to the mass substance (,A,,B) and the auxiliary substrate (,A,,B), and the auxiliary substrate (,A,,B) to the cap (,A,,B) are made by direct bonding.

Acceleration sensor

A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

Circuit board and semiconductor device, and method of manufacturing the same

An information recording/reproducing apparatus removably holding a disk cartridge including a case having a head window and a recording medium stored in the case is provided. The apparatus includes: a rotation mechanism; a cartridge loading mechanism for transporting the disk cartridge from a first unloading position to a first recording/reproducing position when the disk cartridge is mounted, and for transporting the disk cartridge from the first recording/reproducing position to the first unloading position when the disk cartridge is removed; and a head loading mechanism for transporting the head from a second unloading position to a second recording/reproducing position after the disk cartridge has been placed at the first recording/reproducing position when the disk cartridge is mounted, and for transporting the head from the second recording/reproducing position to the second unloading position before the disk cartridge is transported from the first recording/reproducing position to the first unloading position when the disk cartridge is removed. The second unloading position is set outside the periphery of the disk cartridge at the first recording/reproducing position.

Information recording/reproducing device including a head

A magnetic recording and reproducing apparatus comprising: a magnetic recording and reproducing medium; a spindle motor for effecting rotational drive of the magnetic recording and reproducing medium; a transducer for recording and reproducing information on one face of the magnetic recording and reproducing medium; a displacement member for displacing the transducer to an arbitrary radial position on the face of the magnetic recording and reproducing medium; an electric circuit board for processing the information and controlling the spindle motor and the displacement member; and a casing in which the magnetic recording and reproducing medium, the spindle motor, the transducer, the displacement member and the electric circuit board are mounted; the casing having a bottom wall such that a boxlike space is defined below the bottom wall; the electric circuit board being disposed in the boxlike space.

Casing of a magnetic recording and reproducing apparatus having rails

A magnetic disc apparatus has a rocking type actuator driven in a rocking motion by the driving force of a VCM (voice coil motor). Two flexible bending members fixed to a rotor move in synchronization with the driving of the rocking type actuator. The respective flexible bending members are attached to two FPC (Flexible printed circuit sheet) fixing portions provided on the outer wall of the rotor and radially arranged with respect to the driving center of the rocking type actuator so as to have the bending portions bent in directions opposite to each other. The reaction forces of the flexible printed circuit sheets are then canceled out with respect to each other at all times, and hardly affect the driving of the actuator. Therefore, reserve power may be given to the VCM (voice coil motor) while an actuator having a favorable follow-up characteristic with respect to data tracks can be obtained.

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Osaka, Japan

Yuji Yagi