Showa Denko Materials Co., Ltd.

Resonac Corporation

Hitachi Chemical Company, Ltd.

Yuji Tosaka

Takeshi Saitoh

Hiroshi Shimizu

Yukio Nakamura

Ryohta Sasaki

Ryoichi Uchimura

Masaki Yamaguchi

Kosuke Murai

Tetsuro Iwakura

Junki Somekawa

Yuichi Shimayama

Masashi Oji

Yoshinori Satoh

Provided is a production method of an FRP precursor. The method includes: a pre-coating step of applying a resin varnish having a filler content of 5 vol % or less in a solid content thereof, to a sheet-shaped aggregate, and a melt-pasting step of melt-pasting a pair of resin films, each having a filler content of 30 vol % or more, to both surfaces of the aggregate, after the pre-coating step.

Method for producing FRP precursor

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.0.12&#x3c;{(1+2)/2}/&#x2003;&#x2003;(1)0.8&#x2264;1/2&#x2264;1.25&#x2003;&#x2003;(2)

Metal-clad laminate, printed wiring board and semiconductor package

Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Printed wiring board and semiconductor package

Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the method and the device have a good productivity, and under a normal pressure, enable filling of a resin into a bulk gap of an aggregate as well as prevent the resin from spouting out from an edge portion thereof. The method for producing the FRP precursor is to produce the FRP precursor by melt-adhering each of a pair of thermosetting resin filmsto each of both surfacesandof an aggregatethat is in a form of a sheet, the method comprising: an aggregate's surface heating process to heat aggregate's both surfaces, i.e., the both aggregate's surfacesandof the aggregate, and a film press-adhering process to obtain the FRP precursor wherein under a normal pressure, one aggregate-side film surfaceof the pair of the filmsis press-adhered to one surface of the heated both aggregate's surfaces, and another aggregate-side film surfaceof the pair of the filmsis press-adhered to another surface of the heated both aggregate's surfaces.

Method for producing FRP precursor and device for producing same

Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

Growing community of inventors

Tokyo, Japan

Yuji Tosaka