Az Electronic Materials (luxembourg) S.a.r.l.

Az Electronic Materials USA Corp.

Merck Patent Gmbh

Ridgefield Acquisition

Yuji Tashiro

Toshiaki Nonaka

Daishi Yokoyama

Takashi Fuke

Naofumi Yoshida

Yasuaki Tanaka

Takashi Sekito

Megumi Takahashi

Katsuto Taniguchi

Atsuko Noya

Takashi Fujiwara

Toshiakai Nonaka

Daishi Tokoyama

[Problem] To provide a novel polymer, which fills trenches having narrow widths and high aspect ratios and can form a thicker film. [Means for Solution] The block copolymer comprises a linear or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon.

Block copolymer comprising block having polysilane skeleton and block having polysilazane skeleton

An optical functional film containing a siliceous material, wherein a refractive index nof one surface A of said optical functional film to light is larger than a refractive index nof the other side surface B to light, and the refractive index to light gradually decreases from said surface A to said surface B and wherein when a refractive index of a medium X coming into contact with said surface A is nand a refractive index of a medium Y coming into contact with said surface B is n, the relation n&#x3c;n&#x3c;n&#x3c;nis satisfied and wherein the film is manufactured by the steps of a first layer forming step and a second layer forming step; and a heating step of heating to cure said first layer and said second layer, wherein the contacting parts of said first layer and said second layer are compatibilized.

Optical functional film and method for producing the same

An object of the present invention is to provide a composite of silicon oxide nanoparticles and a silsesquioxane polymer, from which a cured film having a low refractive index can be formed inexpensively. Provided are a method of producing a composite of silicon oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal or a silane monomer with silicon oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in a mixed solvent of an aqueous solvent and an organic solvent in the presence of a phase transfer catalyst, and a composite produced by the method.

Composite of silicon oxide nanoparticles and silsesquioxane polymer, method for producing same, and composite material produced using composite thereof

A heat- or photo-curable composition comprising: a polysiloxane which is produced by reacting a silicon compound (i) represented by the formula: RSi(X)(wherein Rrepresents an alkyl group, an aryl group or the like; X represents a chlorine atom or an alkoxy group; and n represents 0 to 2) with a silicon compound (ii) represented by the formula (b) or (c) (wherein Rto Rindependently represent an alkyl group or the like; Mand Mindependently represent an arylene group, an alkylene group or the like; and Yto Yindependently represent a chlorine atom or an alkoxy group) in the presence of an alkali catalyst or an acid catalyst; a polymerization initiator which enables the generation of an acid or a base by the action of heat or light; and a solvent. The composition enables the formation of a thick film. When the composition is coated onto a substrate, is then heated or exposed to light, is then developed if necessary, and is then heated and cured at a low temperature, a cured film can be formed. 

Silicon-containing heat- or photo-curable composition

To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having an ureido bond, a polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, and developed, so that a cured film can be obtained without carrying out post-exposure baking.

Negative-working photosensitive siloxane composition

A positive-type photosensitive siloxane composition which comprises (I) two or more polysiloxanes that differ in the rate of dissolution in aqueous tetramethylammonium hydroxide (TMAH) solutions, (II) a polysiloxane that gives a film which after prebaking has a rate of dissolution in 2.38 wt-% aqueous TMAH solution of 50-1,000 &#x212b;/sec and that has a group soluble in aqueous TMAH solution, other than silanol, (III) a diazonaphthoquinone derivative, and (IV) a solvent.

Positive-type photosensitive siloxane composition

[Problem] An object of the present invention is to provide a composite of metal oxide nanoparticles and a silsesquioxane polymer, which can form a high-quality cured film wherein aggregation and the like of metal oxide do not occur during a curing process and the metal oxide is uniformly dispersed. [Means for Solution] Provided are: a method of producing a composite of metal oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal, or a silane monomer with metal oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in an aqueous solvent in the presence of a phase transfer catalyst; and a composite produced by the method.

Composite of metal oxide nanoparticles and silsesquioxane polymer, method for producing same, and composite material produced using composite thereof

[Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.

A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) RSi (OR), a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 &#x212b;/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 &#x212b;/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 &#x212b;/sec relative to a 2.38 weight % TMAH aqueous solution. (In the formula, Rrepresents a C1-20 linear or branched cyclic alkyl group, in which any methylene may be substituted by oxygen, or a C6-20 aryl group, in which any hydrogen may be substituted by fluorine; n represents a 0 or a 1; and Rrepresents a C1-5 alkyl group.)

Positive photosensitive siloxane composition

[Object] To provide a coating composition excellent in coatability and free from viscosity increase caused by degradation over time, and also to provide a hardened film-formation method employing that. [Means] The present invention provides a coating composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, and a polyol having hydroxyl groups at both ends of a straight 2 to 5 carbon atom hydrocarbon chain. This coating composition enables to form a hardened film of high transparency, of high insulation and of low dielectricity.

Coating composition containing siloxane resin

A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR)in general formula (1) and the silane compound represented by Si(OR)in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 &#x212b;/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 &#x212b;/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent. (In the formula: R represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, in which any methylene may be replaced by oxygen, or represents an aryl group having 6 to 20 carbon atoms, in which any hydrogen may be replaced by fluorine; and Ris an alkyl group having 1 to 5 carbon atoms.)

A composition comprising a silicon-containing copolymer having a number-average molecular weight of 500 to 1,000,000, having SiO bond in the polymer and containing at least the structural units represented by the following general formulae (I) and (II) and, if necessary, one or more of the structural units represented by the following general formulae (III) to (VII) and a cross-linking agent is reacted at &#x2212;20 to 100&#xb0; C. for 1 to 3 hours. The resultant reaction composition is coated on a substrate and cured by heating to a temperature of 150&#xb0; C. or above, for example, 250&#xb0; C. to obtain a cured product of a silicon-containing copolymer which has a high heat resistance, a high light transmission, a low relative dielectric constant and a high chemical resistance and which has a strong mechanical strength and a good flexibility. wherein Rto R, Rand Reach independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkylamino group, an alkylsilyl group or an alkoxy group, Rrepresents a divalent group, Rrepresents a divalent aromatic group, and A represents NH or O.

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Kakegawa, Japan

Yuji Tashiro