Sharp Kabushiki Kaisha Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Mita Industrial Co., Ltd.

Kyocera Mita Corporation

Panasonic Intellectual Property Management Co., Ltd.

Nipro Corporation

Sunlux Corporation

Kyocera Corporation

Nintendo Co., Ltd.

Joled Inc.

Yuji Tanaka

Hirofumi Kawaguchi

Toshiyuki Fukami

Kenji Okumoto

Yasufumi Mizuta

Ichiro Yamazato

Hiroaki Iwasaki

Yukikatsu Imanaka

Nobuko Akiba

Fumio Sugai

Yukimasa Watanabe

Sakae Saito

Syunichi Matsumoto

Hisakazu Uegaito

Masakatsu Hayashi

Eiichi Miyamoto

Hidekazu Takata

Ken Sumitani

Hideo Nakamori

Hidehiro Saho

Atsushi Fujii

Mitsuo Ihara

Akiyoshi Urano

Yasuo Nagasawa

Yoshitomo Tanaka

Tsutomu Egashira

Shigeru Kitahara

Naotoshi Kashima

Hiroyuki Fukusako

Hiroki Kokubu

Tomohiro Kimura

Shinichi Tanaka

Osamu Okuda

Masaki Hashimoto

Takashi Ohta

Haruo Isaka

Yoshihiko Sano

Katsuya Miyagawa

Mikio Kakui

Masahiro Yasohara

Yoshifumi Okauchi

Takeyuki Kawase

Nariaki Tanaka

Tetsuro Tomoe

Yasuyuki Hanatani

Kazuyuki Takada

Takashi Osako

Yasushi Kato

Takayuki Murai

Yasumichi Mori

Takashi Terada

Kouhei Koresawa

Masayuki Sakamoto

Kazushige Morita

Yoshikazu Kishigami

Hirokazu Kobayashi

Mitsuji Tsujita

Haruyasu Fukui

Ryutaro Arakawa

Kouji Takada

Jun Yamauchi

Shinichi Suzuki

Yuzuru Inaba

Koichi Nagata

Takehiko Ide

Shinichi Emura

Shingo Sagata

Takashi Takeda

Toshiyuki Kino

Masamitsu Onitani

Tohru Ueno

Takuji Terada

Hiroshi Mishima

Takeshi Watanabe

Shigeki Yamada

Kazuo Matsumoto

Tetsuya Adachi

Hidehito Nakamura

Hirohisa Koizumi

Tomio Tanaka

Shu Kurashima

Kazuyoshi Nakamura

Kouji Okada

Akihiro Nishiyama

Yuichi Uchikawa

Masanari Esaki

Yasuhiro Sasaki

Yasuhiko Yoshihara

Yasuyuki Aikawa

Shuji Nagao

Takeshi Nakagawa

Tetsuji Ono

Masanobu Aramaki

Hidetaka Taguchi

Norio Amamoto

Keisuke Shiba

Tetsuo Hayama

Takashi Morishita

Takahisa Shiramizu

Fumihide Maeda

The present display device includes a light-emitting element including a first electrode, a second electrode, and an active layer disposed between the first electrode and the second electrode, the active layer including quantum dot light-emitting layers, and a light source element that irradiates the quantum dot light-emitting layers with ultraviolet rays.

Display device having light-emitting element and light source element irradiating ultraviolet rays

A display device includes a light-emitting element layer including a first electrode and a second electrode, and a first quantum dot light-emitting layer disposed between the first electrode and the second electrode, and a light source element configured to irradiate the light-emitting element layer with ultraviolet light.

Display device

A network system including a customer replaceable unit (CRU) having an excellent security function for operation information which system can realize improvement of the use efficiency of operation information for making the CRU operate, and reduction in costs, is provided. An apparatus main body of a multifunction printer, a server, a personal computer, etc. are connected to a network of a network system, and a CRU is attached to the apparatus main body so as to be detachable. Operation information necessary for making the CRU operate is stored in the server. The apparatus main body obtains operation information of the CRU from the server via the network and stores the obtained operation information into a buffer memory, and causes the CRU to operate based on the operation information. The operation information stored in the buffer memory is erased when communication between the apparatus main body and the CRU ends.

Network system comprising customer replaceable unit

A method for producing a light-emitting device includes preparing a supporting substrate forming a porous layer on or above the supporting substrate, the porous layer being an organic material layer and containing a plurality of pores, and forming a transparent substrate on or above the porous layer. The method further includes forming a light-emitting element on or above the transparent substrate, breaking the porous layer at a portion inside the porous layer or at an interface between the supporting substrate and the porous layer, and separating the supporting substrate from the transparent substrate while at least part of the broken porous layer is attached to the transparent substrate.

Light-emitting device with transparent substrate

A manufacturing method of a flexible device comprises: an adjustment step of adjusting adhesive characteristics of an adhesive layer formed over a supporting substrate; a temporary bonding step of temporarily bonding the flexible substrate; an electronic device formation step of forming an electronic device; and a separation step of separating the flexible substrate. In the adjustment step, the adhesive characteristics of the adhesive layer are adjusted to satisfy a relationship of P&#x3c;P, where Pdenotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step without undergoing the adjustment step, and Pdenotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step after undergoing the adjustment step.

Method for manufacturing flexible device

A light-emitting device includes a transparent substrate having a first surface and a second surface opposite to the first surface. A light-emitting element is provided on the first surface of the transparent substrate and emits light. A porous layer is provided on the second surface of the transparent substrate, the porous layer including an organic material and having pores. The porous layer does not include an inorganic compound.

A supported resin substrate comprises a supporting substrate, a release layer arranged on the supporting substrate and containing a metal or a metal oxide, and a resin substrate arranged on the release layer, the resin substrate including a front surface region opposite the release layer and a rear surface region in contact with the release layer. The resin substrate consists essentially of a resin material containing elemental fluorine. The ratio of the compositional proportion of fluorine in the rear surface region of the resin substrate to that in the front surface region of the resin substrate is 0.45 or less.

Supported resin substrate and method for producing the same and electronic device in which the supported resin substrate is used

There is provided a supported resin substrate including a supporting substrate, a release layer arranged on the supporting substrate, the release layer containing a metal oxide, and a resin substrate arranged on the release layer, the resin substrate including a first surface region opposite the release layer and a second surface region in onto t with the release layer, in which the resin substrate consists essentially of a resin material having a C&#x2550;O bond, and the proportion of the C&#x2550;O bond present in the second surface region of the resin substrate is lower than the proportion of the C&#x2550;O bond present in the first surface region of the resin substrate.

Supported resin substrate, method for producing the same, and electronic device including resin substrate

A light-emitting device includes a transparent substrate, a light-emitting element arranged on or above one main surface of the transparent substrate, and a porous layer arranged on or above the other main surface of the transparent substrate, the porous layer being an organic material layer having a plurality of pores. Inner surfaces of some pores among the plurality of pores may be exposed at a main surface of the porous layer opposite to a side on which the transparent substrate lies. A gas may be present in the pores the inner surfaces of which are exposed.

Laminated substrate, light-emitting device, and method for producing light-emitting device

An electronic component manufacturing method according to an aspect of the present disclosure includes providing a support substrate, forming a release layer including a metal or a metal oxide on a first surface of the support substrate, forming a resin substrate on the release layer, forming a functional element on the resin substrate, and separating the resin substrate from the support substrate by applying laser light to the support substrate through a second surface of the support substrate. The laser light that reaches an interface between the resin substrate and the release layer after being transmitted through the support substrate and the release layer has an energy density lower than a threshold for the resin substrate to be processed by the laser light.

Method for manufacturing electronic device comprising a resin substrate and an electronic component

A display device according to the present disclosure includes: a first substrate including a front surface and a rear surface, the front surface defining thereon a first region, a second region, and a third region, the rear surface defining thereon a fourth region, a fifth region, and a sixth region respectively opposing the first region, the second region and the third region; a display element provided on the first region; a wire provided on the second region and electrically connected to the display element; a driving element provided above the third region; and a second substrate provided to be in contact with the fourth region, the fifth region, and the six region, and being composed of a material with higher rigidity than the first substrate, a portion thereof in contact with the sixth region having a smaller thickness than a portion thereof in contact with the fourth region.

Display device and method for manufacturing the same

Flexible device manufacturing method including: forming thin film by coating surface of support with predetermined solution in state where hydroxyl groups are present on surface; forming releasing layer by baking thin film; forming flexible substrate on releasing layer; forming device on flexible substrate; and releasing releasing layer, flexible substrate and device from support at interface between support and releasing layer. Predetermined solution contains alkylsilane alkoxide derivative and titanium alkoxide derivative. Baking temperature for baking thin film is at least 200&#xb0; C. and at most 350&#xb0; C. Ratio of number of silicon atoms in alkylsilane alkoxide derivative to number of titanium atoms in titanium alkoxide derivative is 3.3:1 to 4.1:1 when baking temperature is at least 200&#xb0; C. and less than 270&#xb0; C., 3.3:1 to 23:1 when baking temperature is at least 270&#xb0; C. and at most 330&#xb0; C., and 19:1 to 23:1 when baking temperature is more than 330&#xb0; C. and at most 350&#xb0; C.

Flexible device manufacturing method and flexible device

A flexible display device comprises a device substrate and a flexible circuit substrate, and achieves high reliability of electrical connection. The device substrate includes a flexible substrate, a display unit and a first terminal part. The flexible circuit substrate includes a second terminal part. An ACF including conductive particles connects the first and second terminal parts. Each conductive particle consists of a core part covered by a metal layer. An electrode layer and a cushioning layer are provided between the flexible substrate and the first terminal part. A quotient of a sum of a product of average particle diameter and elastic modulus for the core part, and a product of double average thickness and elastic modulus for the metal layer, divided by a sum of products of average thickness and elastic modulus for the first terminal part, the cushioning layer and the electrode layer, is no greater than 1.5.

Flexible display device

Growing community of inventors

Osaka, Japan

Yuji Tanaka