Toyo Boseki Kabushiki Kaisha

Anderson & Vreelan

Nova Polymer, Inc.

Yuji Taguchi

Keiichi Motoi

Koji Syoki

Satoshi Imahashi

Toru Wada

Toshiaki Fujimura

Masaou Matsuda

Hajime Kouda

Kazuo Takahashi

James P Chapman

Howard B Vreeland, Jr

A photosensitive resin laminate for a sign board is provided, which laminate has a support and a photosensitive resin layer having a thickness of not less than 500 &#x3bc;m formed at least on the support via an adhesive layer, wherein the photosensitive resin layer has an absorbance at 400 nm of not more than 0.4 and the support is a modified polyethylene terephthalate layer on which a UV quality change preventive layer is formed. A sign board obtained using a photosensitive resin laminate of the present invention has a transparent and colorless support having superior design and superior light resistance with a smaller coloring level due to UV. In other words, the photosensitive resin laminate of the present invention can provide a suitable sign board and greatly contributes to the industry.

Photosensitive resin laminate for sign boards

A photosensitive resin laminate comprising at least a support, a photosensitive resin layer and an IR ablation layer, wherein the IR ablation layer comprises an IR absorbent metal layer which is disposed in contact with the photosensitive resin layer.

Photosensitive resin laminate

A photosensitive resin laminate comprising at least a support, an adhesive layer and a photosensitive resin layer, wherein the photosensitive resin laminate shows a total light transmission of not less than 60%, or satisfies the following formula (1):{(A&#x2212;B)/A}&#xd7;100&#x2266;15&#x2003;&#x2003;(1)wherein A is a total light transmission (%) of the support and B is a total light transmission (%) of the photosensitive resin laminate.

Photosensitive resin laminate, and signboard plate and signboard made of the laminate

A photosensitive resin laminate comprising a support and a photosensitive resin layer formed on the support directly or via an adhesive layer, wherein the support has a Shore D hardness of not less than 35&deg;, a thickness of not less than 1 mm, and a total light transmission of not less than 70%. The photosensitive resin laminate of the present invention permits easy bending of the support and is superior in design as evidenced by the thickness and transparency of the support. The inventive laminate is free of generation of odor from the support and can provide a photosensitive resin laminate suitable for sign plate, a sign plate and the like. According to the method of the present invention, a photosensitive resin laminate can be produced efficiently even if a support involved is thick, hard or in a number of sheets, and greatly contributes to the pertinent industrial field.

Photosensitive resin laminate and production method thereof

A multilayered photopolymer element made up of at least a support, a photosensitive layer and a cover film. The photosensitive layer is composed of at least two layers and the uppermost layer in the photosensitive layer contains a sensitivity controlling agent bonded with a polymer. The shape of the shoulder at a relief top is made sharp-edged whereby a printing plate having excellent print quality without being thickened by impression is prepared.

Multilayered photopolymer element including sensitivity controlling agents

A photosensitive resin composition which is excellent in flexibility and impact resilience, which is less affected by humidity is provided. This composition comprises a soluble synthetic polymer, a photo-polymerizable unsaturated compound, and a photo-polymerization initiator, wherein the soluble synthetic polymer comprises an addition polymer obtained by the reaction between a diamine compound having amino groups selected from primary and secondary amino groups and having no amide bonds in its molecule and a diisocyanate compound; and the addition polymer contains a polyoxyalkylene glycol component in an amount of 20 to 80% by weight.

Growing community of inventors

Ohtsu, Japan

Yuji Taguchi