Toyota Jidosha Kabushiki Kaisha

Denso Corporation

Yuji Sugino

Keisuke Yasuda

Motohiro Shirai

Hiroyuki Nakamura

Shu Kuroda

In this brazing method, which brazes an insulating substrate and a top plate that configure an HV inverter cooler, the insulating substrate is disposed on the top plate with a brazing material layer therebetween, and then, by means of laser irradiation, laser welding is performed at an arbitrary plurality of positions at the joining section between the top plate and the insulating substrate, thus provisionally affixing the insulating substrate to the top plate. Thereafter, by means of heating and melting the brazing material layer, the insulating substrate is brazed onto the top plate with the plurality of laser-welded positions as the brazing start points. After brazing, a power semiconductor is joined onto the insulating substrate corresponding to the center portion of the region surrounded by the plurality of brazing start points.

Brazing method and brazed structure

In a heat exchanger, a liquid resin is applied to an outer surface of the heat exchanger, and then surplus liquid resin is removed from the outer surface. In removing the surplus liquid resin, before air having a first velocity is directed to the heat exchanger for blowing the surplus liquid resin off the heat exchanger, air having a second velocity lower than the first velocity is directed to the heat exchanger to remove the surplus liquid resin from the heat exchanger by moving the surplus liquid resin along the outer surface of the heat exchanger. The air at the second velocity is directed toward the heat exchanger by a second blower before the air at the first velocity is directed toward the heat exchanger by a first blower.

Growing community of inventors

Nishio, Japan

Yuji Sugino