Mitsubishi Electric Corporation

Yuji Shirakata

Kenta Fujii

Koji Nakajima

Takashi Kumagai

Masahiko Fujita

Dai Nakajima

Tomohito Fukuda

Shota Sato

Masahiro Ueno

Masao Kikuchi

Tomoaki Shimano

Masaki Kato

Toru Kimura

Toshiaki Kashihara

Yujiro Kido

Hitoshi Isoda

Yoshikazu Tsunoda

Jun Tahara

Hiroyuki Yahara

Kozo Harada

Kenji Fujiwara

Yoshinobu Utsumi

Naohide Maeda

Teruo Miyamoto

Junichi Nakashima

Takao Mitsui

Hiroyuki Kiyonaga

Tsuneo Hamaguchi

Masanori Kageyama

Keiji Harada

Kazuyasu Sakamoto

Takuya Oga

Kenji Nishizaka

Kunihiko Tajiri

Yuta Yoshimi

Kazushi Ikurumi

A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.

Circuit device

A power conversion apparatus includes a hermetic housing, a power semiconductor module, and dry gas. The hermetic housing includes a gas inlet valve and a gas outlet valve. The power semiconductor module is arranged in an internal space in the hermetic housing. The internal space in the hermetic housing is filled with dry gas.

Power conversion apparatus, electric power system for aircraft, and method of controlling power conversion apparatus

A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.

Power conversion device

A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.

There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting between a melted material and a peripheral member can be suppressed even when a fuse portion is melted by an excessive current. An electric-power conversion apparatus includes an electric power semiconductor device, an electrode wiring member, a case, a fuse portion formed in the electrode wiring member, a fuse resin member disposed between the fuse portion and the case, and a sealing resin member that seals the electric power semiconductor device, the electrode wiring member, the fuse portion, and the fuse resin member in the case.

Electric-power conversion apparatus

A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Circuit device and power conversion device

An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.

Isolated converter

Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Power circuit device

A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.

Cooling device, lid-equipped cooling device, case with cooling device, and inverter

A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

Circuit device and power converter

There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case. Along a current-flowing direction, the fuse portion includes an upstream-side first step portion whose cross-sectional area is smaller than that of the portion at the upstream side thereof, a second step portion whose cross-sectional area is smaller than that of the upstream-side first step portion, and a downstream-side first step portion whose cross-sectional area is larger than that of the second step portion but is smaller than that of the portion at the downstream side thereof.

In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

Electronic circuit board and power conversion device

A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

Semiconductor device

A power converting device such that an overcurrent is interrupted and damage to a power semiconductor element can be prevented is obtained. The power converting device includes a power semiconductor element, a wiring member connected to an electrode of the power semiconductor element, a bus bar that supplies power to the power semiconductor element, and a frame that houses the power semiconductor element, wherein the bus bar has a connection terminal connected to the wiring member, and a fuse portion is provided in the connection terminal.

Power converting device

An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.

Growing community of inventors

Tokyo, Japan

Yuji Shirakata