Brother Kogyo Kabushiki-Kaisha

Yuji Shinkai

Takeshi Asano

Atsuo Sakaida

Atsushi Hirota

Kouji Inaishi

Chisato Yoshimura

Koji Imai

Takeo Iwasaki

Hideo Maruyama

Tsuyoshi Ohashi

Tomoyuki Kubo

Takaaki Banno

Tsuyoshi Eguchi

Naohiko Tani

Katsuo Minakata

A connection structure for connecting a wiring board to a to-be-connected body having electric contacts, the wiring board including: a base having board-side contacts provided on its facing surface that is to face the to-be-connected body; and a cover film which covers the facing surface except the board-side contacts and a non-covered partial region of the facing surface, the connection structure including: conduction portions formed of electrically conductive resin, for bonding the electric contacts and the board-side contacts to permit electrical conduction therebetween; and a reinforcement portion formed of the same resin as the conduction portions and disposed at a position which is different from positions of the conductive portions and at which the reinforcement portion extends across both of a surface of the cover film and a surface of the non-covered partial region of the base, the reinforcement portion bonding the to-be-connected body and the wiring board for reinforcing connection therebetween.

Connection structure and connection method of wiring board

In an antenna formed by a substantially thin-plate state conductive member on a base material, a surface area expanding portion is provided at least substantially at a center part in a direction orthogonal to a direction in which an electric current flows. The surface area expanding portion is a projection portion provided in a projecting state with respect to a peripheral portion (or a concave portion arranged concaved than the peripheral portion). A width dimension of the projection portion (or the concave portion) in a cross-sectional face is twice or more of a skin depth of the electric current in the cross sectional face.

Pattern antenna, tag antenna and pattern transmission path

An inkjet head includes an ink passage unit, an actuator unit; a printed circuit board; a metallic bond for electrically connecting a land to a terminal, the metallic bond being disposed in at least one of a region between the land and the terminal and a region extending over the land and the terminal along the peripheries of the land and the terminal; and a protrusion disposed on the connecting portion between a main electrode portion and the land.

Inkjet head capable of suppressing hindrance of deformation of a piezoelectric element

A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond and the thermosetting resin so that the land and the terminal are electrically connected to each other with the metallic bond being disposed in at least one of a region between the land and the terminal and a region extending over the land and the terminal along the peripheries of the land and the terminal, and a protrusion made of the thermosetting resin is formed at least in the connecting portion between the main electrode portion and the land.

Manufacturing an ink jet head

A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first substrate, each metal core coated with a solder layer lower in a melting point than the metal core; forming the conductive second terminals on the second substrate; and electrically bonding the first terminals to the second terminals by heating the first and second substrates while applying pressure to the first substrate and the second substrate. In the forming of the first terminals, a ratio of a height of the metal core from the surface of the first substrate in a thickness direction of the first substrate to a thickness of the solder layer in the thickness direction of the first substrate is in a range of from 1:1 to 2:1.

Method for manufacturing bonded substrates and substrates for use in the bonded substrates

A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.

Method of manufacturing an ink-jet assembly

A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which respectively correspond to the recording elements; and (B) a printed wiring board which includes conductive leads respectively having terminal portions, which is electrically connected to the individual electrodes, and through which an operating signal for operating the recording elements is supplied to the individual electrodes, the method including: forming a plurality of conductive bumps on a surface of the actuator unit such that the bumps protrude from the surface of the actuator unit, so as to be electrically connected to the individual electrodes, respectively; coating a surface of the printed wiring board with an uncured synthetic resin to form an uncured synthetic-resin layer covering the conductive leads of the printed wiring board; bringing the bumps and the terminal portions of the conductive leads into contact with one another by pressing the bumps onto the uncured synthetic-resin layer such that the bumps penetrate the uncured synthetic-resin layer; and curing the uncured synthetic-resin layer.

Recording head unit and method of producing the same

An ink-jet head includes a passage unit including a plurality of pressure chambers, and a plurality of actuator units attached to a surface of the passage unit for changing the volume of each of the plurality of pressure chambers. The actuator unit has a layered structure laminated with four piezoelectric sheets to. In the actuator unit, individual electrodes are formed at positions respectively corresponding to each of the pressure chambers, only on a face of the uppermost piezoelectric sheet opposite to an attached face of the actuator unit to the passage unit. A common electrode kept at a constant potential is provided on a face of the uppermost piezoelectric sheet at the side facing the passage unit.

Ink jet head and ink jet printer

A method for manufacturing an ink-jet head, including forming a mark for indicating the positions of pressure chambers on a surface of a passage unit; preparing a member containing a piezoelectric sheet on which a common electrode is supported; attaching the member to the surface of the passage unit; and forming individual electrodes, based on the mark, on a face of the member facing the direction opposite to the attached face thereof to the passage unit.

Method for manufacturing an ink-jet head

A method of electrically connecting a wiring member to a plurality of electrodes which respectively correspond to a plurality of recording elements of a recording head, the wiring member including a plurality of wire portions and a plurality of terminal portions each of which is connected to the corresponding wire portion, the method including: forming convex bumps by using a conductive solder, respectively on the plurality of terminal portions; and connecting the plurality of terminal portions and the plurality of electrodes respectively to one another via the respective convex bumps by heating and melting the convex bumps at a predetermined temperature with the convex bumps pressed respectively onto the plurality of electrodes with a predetermined load, wherein the connecting the plurality of terminal portions and the plurality of electrodes is carried out such that the predetermined load and the predetermined temperature are decreased with an increase in a height of the convex bumps.

Method of connecting wiring member

In an ink jet head according to the invention, an electrode provided on an actuator board has two-layer structure. A first layer is made of a noble metal such as palladium containing phosphorus or boron with a property of being able to form a layer directly on a piezoelectric element of the actuator board, such as PZT. A second layer, to be formed on the first layer, is made of a noble metal the same kind of metal used for the first layer and with high degree of purity close to 100%. This structure improves corrosion resistance to ink, eliminates the necessity to form a conventional protective layer, and leads to reductions of the manufacturing steps and costs.

Ink jet head and producing process therefor

The invention relates to an optical microlens array producing method. The microlens array producing method according to the invention uses an intermediate material forming process for forming an intermediate material of photoresist on a flat sheet, the intermediate material having projections formed in the shape of a predetermined pattern; a resist master forming process of forming a resist master by heating the intermediate material to thereby smooth the surfaces of the projections; an inverted mold forming process for forming an inverted mold having a surface shape that is the inverse of the resist master; a clad portion forming process, for forming a clad portion having grooves equal in sectional shape to the inverted mold, using the inverted mold and also using a first light-transmitting material of a low refractive index; a process for forming microlenses by filling the concave portion of the clad portion with a second light-transmitting material which is higher in refractive index than the first light-transmitting material microlens with index than the first or the second light-transmitting.

Method for producing a microlens array

The invention relates to an optical waveguide array producing method. The optical waveguide array producing method according to the invention uses an intermediate material forming process for forming an intermediate material of photoresist on a flat sheet, the intermediate material having projections formed in the shape of a predetermined pattern; a resist master forming process of forming a resist master by heating the intermediate material to thereby smooth the surfaces of the projections; an inverted mold forming process for forming an inverted mold having a surface shape that is the inverse of the resist master; a clad portion forming process, for forming a clad portion having grooves equal in sectional shape to the inverted mold, using the inverted mold and also using a first light-transmitting material of a low refractive index; a process for forming core portions by filling the grooves of the clad portion with a second light-transmitting material which is higher in refractive index than the first light-transmitting material; and a process of covering the core portions with a third light-transmitting material lower in refractive index than the first or the second light-transmitting material.

Method for producing an optical waveguide array using a resist master

In the optical waveguide array according to the present invention, a clad portion and cores formed by curing photocurable resins are sandwiched between two reinforcing members, at least one of which has a light transmitting characteristic. The clad portion covers the cores. The method of manufacturing the optical waveguide array according to the present invention comprises applying a first photocurable resin to a mold having an optical waveguide pattern of the optical waveguide array; placing a first reinforcing member having a light transmitting characteristic closely on the upper surface of the photocurable resin and then radiating light from above the first reinforcing member to form a clad layer having grooves corresponding to the optical waveguide pattern, the clad layer being bonded firmly to the first reinforcing member; pouring a second photocurable resin, having a refractive index higher than that of the first photocurable resin, into the grooves of the clad layer; radiating light from above the first reinforcing member to cure the second photocurable resin to thereby form cores; applying a third photocurable resin, having a refractive index lower than that of the second photocurable resin, onto the core-formed surface of the clad layer and then placing a second reinforcing member on the third photocurable resin; and radiating light from above the first reinforcing member to cure the third photocurable resin applied to the core-formed surface of the clad layer to thereby form a photocured resin layer and bonding the second reinforcing member firmly to the photocured resin layer. Alternatively, if the second reinforcing member is also has a light transmitting characteristic, light can be radiated through the second reinforcing member to cure the third photocurable resin.

Growing community of inventors

Handa, Japan

Yuji Shinkai