Hitachi, Ltd.

Fujitsu Hitachi Plasma Display Limited

Other

Hitachi Maxell, Limited

Chugai Seiyaku Kabushiki Kaisha

Fujitsu Corporation

Yuji Sano

Kouji Kitou

Ikuya Arai

Toyoshi Kawada

Michitaka Ohsawa

Takashi Sasaki

Tomokatsu Kishi

Hirokazu Inoue

Akihiro Takagi

Masaji Ishigaki

Hitoshi Hirakawa

Noboru Akiyama

Makoto Onozawa

Fumitaka Asami

Hiroshi Ohtaka

Norio Yatsuda

Kazuo Yoshiikawa

Yoshinori Okada

Sadao Tsuruga

Eiji Matsuzaki

Nobuyuki Ushifusa

Seiichi Tsuchida

Yoshio Amemiya

Shinichi Yamada

Takuya Imaide

Hiroshi Koizumi

Takeshi Hoshino

Toshimitsu Watanabe

Nobutaka Okuyama

Eiichi Yamazaki

Yuichiro Kimura

Michitaka Osawa

Nobuo Azuma

Kiyoharu Kishimoto

Yasuko Kinoshita

Takahiro Ishiguro

Moritaka Taniguchi

Tsukasa Suzuki

Ken Hashimoto

Teruo Takai

Yumiko Kawai

Masaaki Kurosu

Toshiaki Tsunenari

Mika Endo

Tomoko Ogawa

Hitoshi Yamadera

Osamu Hirohashi

Tadayoshi Oikawa

Mariko Tanaka

Mei Ono

Masahide Kawai

The present invention provides anticancer agents comprising as an active ingredient a bispecific antibody that comprises a domain comprising a glypican 3-binding antibody variable region, a domain comprising a T cell receptor complex-binding antibody variable region, and common L chains that can enhance the affinity for the two antigens, as well as pharmaceutical compositions comprising the bispecific antibody as an active ingredient, the compositions being for use in combination with other anticancer agents. The bispecific antibodies are novel molecules which are produced with high efficiency and have strong anti-tumor activity as well as safety and excellent pharmacodynamics. The bispecific antibodies can be expected to be applied to various cancers.

Cell injury inducing therapeutic drug for use in cancer therapy

As a result of producing anti-DDR1 antibodies and conducting extensive studies on the antitumor activity thereof, antibodies that bind to the stalk domain in the amino acid sequence of human DDR1 were found to have a potent activity even when used alone compared to antibodies that bind to other domains. It was also found that the antibodies have one or more activities selected from the group consisting of: (i) an activity to suppress cell proliferation, (ii) an activity to inhibit cell migration, (iii) an activity to inhibit phosphorylation of DDR1 in cells, (iv) an activity to be taken up into cells, (v) an activity to decrease the expression level of DDR1 in cells, and (vi) an activity to decrease the expression level of TGF-&#x3b2; in cells.

Anti-DDR1 antibody having anti-tumor activity

A plasma display apparatus including a capacitive load and a driving circuit is provided. The plasma display apparatus includes a driving power source supplying a drive voltage to the capacitive load and a reference potential terminal supplying a reference potential to the capacitive load. A drive IC is coupled to the driving power source.

Capacitive-load driving circuit and plasma display apparatus using the same

A capacitive-load driving circuit has a configuration in which a driving power supply source is connected to an output terminal via a driving device. The capacitive-load driving circuit has a power distributing circuit inserted between the driving power supply source and the driving device. Therefore, temperature rise (power consumption) in the capacitive-load driving circuit can be distributed.

Capacitive-load driving circuit capable of properly handling temperature rise and plasma display apparatus using the same

A load drive circuit, successfully suppressed in unnecessary electromagnetic wave generation through suppressing transition time in the drive voltage waveform even under a reduced effective load, and a display device using this circuit are provided, wherein the circuit comprises a drive circuit inversively amplifying a signal, used for driving a load, input through an input terminal, and output from an output terminal; a first current source connected to the input terminal of the drive circuit and being capable of controlling current output; and a first switch circuit connected between the input terminal of the drive circuit and a first reference potential point.

Load drive circuit and display device using the same

A semiconductor chip mounting substrate having a semiconductor bare chip and a substrate electrically connected to the semiconductor bare chip by wire bonding is provided. Here, a protective film is provided on the surface of the semiconductor bare chip and is disposed so as to expose all or a part of a bonding wire.

Semiconductor chip mounting substrate and flat display

A display panel drive circuit having a plurality of first and second electrodes for connecting to a display panel, a first drive circuit for driving the first electrodes, and a second drive circuit for driving the second electrodes. The second drive circuit is connected to drive all or a part of a plurality of the second electrodes, or interrupted to increase output impedance.

Display panel drive circuit and plasma display

A display apparatus includes a display panel including address electrodes and sustain electrodes crossing the address electrodes, with pixels being sandwiched between the address electrodes and the sustain electrodes. A sustain-electrode drive circuit selectively generates both sustain pulses and scan pulses and supplies them to the sustain electrodes. An address-electrode drive circuit generates address pulses based on a video signal and supplies the address pulses to the address electrodes. A control-signal generation circuit generates a control signal for controlling the sustain-electrode drive circuit to generate a selected one of the sustain pulses and the scan pulses and supplies the control signal to the sustain-electrode drive circuit. In order to display an image on the display panel, the sustain-electrode drive circuit both specifies addresses of pixels to be turned on and turns on the pixels at the specified addresses.

Display apparatus

IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.

IC chip mounting structure and display device

An image display apparatus capable of adjusting a display picture by an input unit through a computer body is disclosed. When the user inputs a control instruction for adjusting the display picture of the display unit by the input unit connected to the computer body, a control signal addition circuit prepares a control signal Sc corresponding to the control instruction and adds the control signal to a video signal R, G or B or a synchronizing signal Hs or Vs produced by a display control circuit during a vertical retrace period. A control signal separation circuit separates the added control signal Sc from the video signal R, G or B or the synchronizing signal Hs or Vs produced by the control signal addition circuit. A display control circuit produces adjustment signals Sa and Sb on the basis of the control signal from the control signal separation circuit to adjust a video circuit and a deflection circuit. Thus, the user can adjust the display picture by the input unit near at hand without extending the hands to adjustment switches of the display unit.

Display unit for displaying an image based on a video signal received from a personal computer which is connected to an input device

A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is joined with pressure applied by the use of an anisotropic conductive film, an anisotropic conductive paste, a non-conductive resin paste, or a non-conductive resin film and the back of the integrated circuit chip is adhered to a metal chassis on a display panel by the use of an integrated-circuit chip adhesive. As a result, the metal chassis can be used as a radiator for the integrated circuit chip. Batch bonding will enable to shorten time for the connection process and to cut down the cost of installations. Furthermore, a radiator is unnecessary, resulting in a low-cost display driver module.

Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis

Image display apparatus

Growing community of inventors

Kawasaki, Japan

Yuji Sano