Fujitsu Corporation

Other

Kyushu Fujitsu Electronics Limited

Yuji Sakurai

Junichi Kasai

Toshimi Kawahara

Kenichi Sasaki

Yuichi Asano

Mitsunada Osawa

Shinichirou Taniguchi

Mayumi Osumi

Yoshitugu Katoh

Hitoshi Kobayashi

Sinya Nakaseko

Hiroyuki Ishiguro

Hiroyuki Ishiquro

A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Semiconductor device and method of producing the same and semiconductor

There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.

Method for mounting a semiconductor device by which deformation of leads

Mounting construction and method of a semiconductor device by which

Growing community of inventors

Murata-machi, Japan

Yuji Sakurai