Citizen Watch Company, Ltd.

Citizen Electronics Co., Ltd.

Yuji Omori

Koki Hirasawa

Sadato Imai

Masahiro Watanabe

Hirohiko Ishii

Nodoka Oyamada

Shingo Kuriki

Kazuki Matsumura

Masahide Watanabe

Makoto Yasuhara

A light emitting device has a substrate, a plurality of light emitting elements mounted on the substrate, a first wavelength conversion members disposed so as to cover at least a portion of the upper surface of at least two light emitting elements of the plurality of light emitting elements, a sealing material sealing the plurality of light emitting elements and the first wavelength conversion members, and a transparent layer formed of a material different from the sealing material and is disposed between the substrate, the plurality of light emitting elements and the first wavelength conversion members, and the sealing material, wherein at least one side of each of the plurality of light emitting elements is disposed so as to face a side surface of the other light emitting element of the at least two light emitting elements, and not cover at least a portion of the non-facing side surfaces thereof.

Light emitting device

Light emitting diode

A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package. The LED package includes: an LED device; a lead frame including a mounting part having an upper surface on which the LED device is mounted and a back surface being in contact with the heat sinking substrate, and an electrode part being thinner than the mounting part and electrically connected to the LED device and the circuit board; an insulating resin filled between the mounting part and the electrode part and between the electrode part and the heat sinking substrate; and a sealing resin filled into a region on the mounting part to seal the LED device.

Light emitting apparatus and method for manufacturing same

Provided is a light-emitting device of which a resin frame serving as a dam of a sealing resin is not readily deformed. The light-emitting device includes: a planar lead frame configured from first and second metal portions which are spaced apart from each other with an insulating resin interposed therebetween; light-emitting elements mounted on the first metal portion and electrically connected by wires to the first and second metal portions; a first resin frame disposed on the lead frame so as to enclose the light-emitting elements; a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements, the sealing resin being filled into a region on the lead frame enclosed by the first resin frame to seal the light-emitting elements; and a second resin frame being harder than the first resin frame and covering an outer surface of the first resin frame at an outer edge of the lead frame.

Light-emitting device

Provided is a light-emitting apparatus including a substrate, an LED light source disposed on the substrate, and a reflecting frame disposed laterally of the LED light source on the substrate, wherein the LED light source includes a side-emitting LED device which is disposed on the substrate, and which emits light laterally toward the reflecting frame, and a top-emitting LED device which is disposed above the side-emitting LED device on the substrate so as to straddle the side-emitting LED device and so as to not block a portion of the light emitted from the side-emitting LED device, and which emits light upward, the light being different in color than the light emitted from the side-emitting LED device, and wherein the reflecting frame is disposed so that the light emitted from the side-emitting LED device is reflected upward.

Light-emitting apparatus

An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

Growing community of inventors

Yamanashi, Japan

Yuji Omori