Nichia Corporation

Yuji Okada

Kensho Sakano

Kazuhiko Sakai

Toshihiko Umezu

Masafumi Kuramoto

Masaki Hayashi

Koji Kuroda

A light-emitting device includes lead frames, a light-emitting element placed on a bottom of a recessed portion formed at one of the lead frames, and a light-transmitting resin covering the light-emitting element. The lead frames have a covered region which is covered with the light-transmitting resin and an exposed region exposed out of the light-transmitting resin. The light-emitting device has a gap between the lead frame and the light-transmitting resin at an inner side surface of the recessed portion, the gap having a width longer than a main wavelength of light from the light-emitting element. The lead frame is in close contact with the light-transmitting resin at an end of the covered region, which is located in a boundary with the exposed region or in the vicinity of the boundary within the covered region.

Light emitting device and method for manufacturing same

Provided is a light emitting device with high extraction efficiency, in which absorption of light by a conductive wire is prevented effectively. The light emitting device includes a conductive wire electrically connecting an electrode of a light emitting element and an electrically conductive member. The surface of the bonding portion of the conductive wire between the conductive wire and at least one of the electrode of the light emitting element and the electrically conductive member is covered with a metal film. The reflectivity of the metal film is higher than that of the conductive wire at the emission peak wavelength of the light emitting element.

Light emitting device and method of manufacturing the same

A method for producing a fluorescent material involving firing a mixture of a stock material and a flux. The method may involve a first firing process involving firing the mixture of the stock material and the flux in a weakly reducing atmosphere, followed by firing the resulting material in a second reducing atmosphere that is more reducing than the first weakly reducing atmosphere. The flux may include a liquid.

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.

Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same

An epoxy resin composition comprising an epoxy resin, a hardening agent and a hardening accelerator as an indispensable ingredients is provided wherein the hardened resin has a high translucency and has little discoloration under high temperature and high humidity and is excellent at heat resistance and light fastness by compounding a phosphonium compound represented by the following formula (I) as a hardening accelerator. 

Epoxy resin composition

Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor

Growing community of inventors

Anan, Japan

Yuji Okada