Disco Corporation

Yuji Nitta

Hitoshi Hoshino

Takashi Okamura

Yuichi Shimizu

Hiroumi Ueno

A sapphire wafer dividing method including a cut groove forming step of forming a plurality of cut grooves on the back side of a sapphire wafer along a plurality of crossing division lines formed on the front side where a light emitting layer is formed, a modified layer forming step of forming a plurality of modified layers inside the sapphire wafer along the division lines, and a dividing step of dividing the sapphire wafer into individual light emitting devices along the modified layers as a division start point, thereby chamfering the corners of the back side of each light emitting device owing to the formation of the cut grooves in the cut groove forming step.

Sapphire wafer dividing method

The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

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Ota-ku, Japan

Yuji Nitta