Casio Computer Co., Ltd.

Yuji Negishi

Kazuhito Sato

A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on an upper side of the upper circuit board and is electrically connected to the first upper-layer wirings. A lower circuit board which is provided on a peripheral part of a lower side of the upper circuit board, the lower circuit board including a plurality of external connection wirings that are electrically connected to the second lower-layer wirings, and an opening portion which exposes the first lower-layer wirings. A second semiconductor structure body which is disposed in the opening portion of the lower circuit board, second semiconductor structure body including a plurality of external connection electrodes that are electrically connected to the first lower-layer wirings of the upper circuit board.

Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same

A semiconductor device includes a first circuit substrate having a plurality of lower wiring lines and a plurality of upper wiring lines on the lower surface side and upper surface side thereof, respectively. A second circuit substrate is provided on a lower side of the first circuit substrate, the second circuit substrate having an opening which exposes part of the first circuit substrate, the second circuit substrate also having, on the lower surface side thereof, a plurality of external-connection connection pads and a plurality of test connection pads connected to the lower wiring lines. A first semiconductor construct is disposed on the lower side of the first circuit substrate within the opening of the second circuit substrate, the first semiconductor construct having a plurality of external connection electrodes connected to the lower wiring lines. A third circuit substrate and/or an electronic component is provided on an upper side of the first circuit substrate and connected to the upper wiring lines.

Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof

A process for manufacturing a liquid crystal display, comprising the steps of providing a first base plate of a resin and a second base plate of a resin, providing at least one of the base plates with an electrically connecting terminal, forming an opening in a base plate of the base plates opposite the electrically connecting terminal when the base plates are bonded to each other, providing at least one of the base plates with a seal, bonding the base plates to each other by means of the seal, providing a space between the base plates with a liquid crystal, and separating the base plates on a line adjoining an edge of the opening. The opening protects the connecting terminal from being physically damaged and separated at the separation step to improve the production yield of the display.

Process for manufacturing liquid crystal display

A method of efficiently orienting liquid crystal molecules on an orientation film formed on one surface of a film substrate which constitutes part of a liquid crystal display panel. In this method, the film substrate is conveyed between a rubbing roll and a backup roll disposed opposite the rubbing roll such that the orientation film faces the rubbing roll, that the rubbing and backup rolls are rotated in contact with the film substrate to thereby rub the orientation film formed on the film substrate for orienting the liquid crystal molecules. Thus, the orientation film formed on the film substrate is continuously rubbed while the film substrate is being conveyed to thereby achieve efficient rubbing.

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Kunitachi, Japan

Yuji Negishi