Seiko Instruments Inc

Sii Printek Inc.

Sii P & S Inc.

Yuji Nakamura

Norimitsu Sambongi

Yoshinori Sato

Noriyoshi Shoji

Yuzuru Kubota

Yuki Yamamura

Yoshiaki Saita

Osamu Takizawa

Suguru Munakata

Yumiko Yamaguchi

Taro Ito

Osamu Koseki

Hitoshi Nakayama

Kazuyoshi Tominaga

Daichi Nishikawa

Daiki Irokawa

Jun Tsuneyoshi

Yasuhito Sekiya

Tomiharu Makishima

Masaki Denda

Kentaro Suzuki

Mizuki Kudo

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

Method of manufacturing head chip and head chip of liquid jet head

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

Method of manufacturing head chip and method of manufacturing liquid jet head

A liquid jet head chip capable of exerting a stable ejection performance is provided. The liquid jet head chip is provided with an actuator plate and an electrode. The actuator plate has an obverse surface, a reverse surface, and two or more ejection channels which penetrate the actuator plate in a thickness direction from the obverse surface toward the reverse surface, which are disposed so as to be adjacent to each other at intervals in a first direction perpendicular to the thickness direction, and which are disposed so as to extend in a second direction perpendicular to both of the thickness direction and the first direction. The electrode is disposed on an inner surface of the ejection channel, and includes a first electrode part covering the inner surface of the ejection channel continuously from the obverse surface toward the reverse surface, and a second electrode part covering the inner surface of the ejection channel continuously from the reverse surface toward the obverse surface, and overlapping at least a part of the first electrode part.

Liquid jet head chip, liquid jet head, liquid jet recording device, and method of forming liquid jet head chip

To provide an ink jet head and an ink jet recording apparatus in which it is possible to reliably prevent ink bubbles from staying in the ink sump and the interior of the head chip and in which it is relatively easy to remove the bubbles. The ink jet head includes: a plurality of grooves arranged side by side so as to communicate with nozzle openings; an ink chamber for supplying ink to each of the grooves; an ink sump provided so as to communicate with the ink chamber; and ink storage unit ( ) communicating with the ink sump through ink supply passages, in which there is provided an air duct ( ) establishing communication between a region in the ink sump which is substantially free from interference with an ink flow from the ink supply passages ( ) to the ink chamber and in which bubbles easily gather and an air region of the ink storage unit ( ). Therefore, the bubbles in the ink can be surely removed.

Ink jet head and ink jet recording apparatus

A thermal head has an insulating substrate, heat resistors formed over a surface of the insulating substrate, an individual electrode formed over the surface of the insulating substrate for supplying electric power to the heat resistors, and a common electrode connected to the individual electrode. A buildup electrode is disposed on the surface of the insulating substrate and is covered by the common electrode for reducing a wiring resistance of the common electrode. The buildup electrode has opposite main surfaces and a tapered side surface having a preselected taper angle relative to the surface of the insulating substrate.

Thermal head

A thermal head has a head chip having an upper surface, a lower surface and a side surface. Heating elements are disposed on the upper surface of the head chip, and electrodes are disposed on the upper surface of the head chip and connected to the heating elements. A wiring substrate is disposed on the lower surface of the head chip. A semiconductor integrated circuit is mounted on the wiring substrate and is in contact with the side surface of the head chip and connected to the electrodes.

Thermal head, thermal head unit, and method of manufacture thereof

A thermal head and a thermal head unit are provided, which can prevent density variation while suppressing the size of the thermal head to be small. In a thermal head ( ) having a head chip ( ) having one surface on which heat generating elements and segment and common electrodes connected to the heat generating elements are provided, and an IC chip ( ) connected to the segment electrodes, the common electrode ( ) provided to the head chip ( ) is elongated in an array direction of the heat generating elements, and connections between the common electrode ( ) and common electrode wirings ( ) are provided at plural locations along the array direction.

Thermal head and thermal head unit

A method of manufacturing a thermal head comprises forming a heating resistor on an insulating substrate and forming a wiring electrode on the heating resistor so that a heating portion of the wiring electrode is disposed around the heating resistor. An inorganic masking agent is disposed on a given portion of the wiring electrode, and a protective film is formed over the heating resistor, the wiring electrode and the inorganic masking agent. The protective film is then removed from the given portion of the wiring electrode together with the inorganic masking agent to selectively form the protective film on the heating resistor and on the heating portion of the wiring electrode.

Method of manufacturing thermal head

A method for manufacturing a thermal head comprises forming a heat generating resistor on an insulative substrate, and disposing conductors having different material properties on the heat generating resistor for supplying power to the heat generating resistor. The conductors are then etched to form a wiring electrode having a tapered peripheral edge portion as a result of the different material properties of the conductors. A protective film is then formed over the heat generating resistor and the wiring electrode.

Growing community of inventors

Chiba, Japan

Yuji Nakamura